WB/DA/FOL (半导体)
深圳市华诚鑫不锈钢有限公司
- 公司规模:1000-5000人
- 公司性质:民营公司
- 公司行业:批发/零售 专业服务(咨询、人力资源、财会)
职位信息
- 发布日期:2013-12-29
- 工作地点:深圳
- 招聘人数:2
- 学历要求:大专
- 语言要求:英语熟练
- 职位月薪:15000-19999
- 职位类别:工艺工程师
职位描述
WB---Sr.Engr
ROLE PURPOSE:
Expert in Wire Bond process for yield improvement & cost reduction. To guide engineers & provide solutions on process problems using analytical and engineering approach.
KEY TASKS & RESPONSIBILITIES:
1. Able to lead a team of engineers with coaching and guiding engineers/technicians.
2. Leading, driving and initiating improvement activities (yield & cost reduction) with cross functional team in Wire Bond.
3. Guiding engineer on trouble shooting with DOE approach, problem solving, report writing & presentation skills.
4. Interaction with customers.
5. Buildsheet & design review.
6. Champion for all wire bond issues that cannot be solved in line level.
7. Provide support on project initiated by others.
JOB REQUIREMENTS:
1. PhD/Master Degree/Bachelor Degree in Material Science, Applied Physics, Mechanical Engineering or related engineering discipline.
2. Master Degree with over 3years or Bachelor Degree with over 5years working experience in related process in high volume semiconductor manufacturing environment.
3. Strong experience in Wire Bonding Process (Au & Copper wire)
4. Familiar K&S, ASM, ESEC & Shinkawa wire bonder
5. Experience with gold wire
6. Experience with copper wire.
FOL mgr--DA
ROLE PURPOSE:
1. To lead the Assembly Process Engineering team (FOL1: Die Attach, Backgring, Wafer Saw, Flip Chip) to support production and improve yield, quality, productivity and reduce cost. To direct the engineering team to provide solutions on process problems using analytical and engineering approach.
2. The successful candidate should be a committed professional and leader with the ability to work in a fast-paced environment and meet urgent deadlines. They must be a self-starter with the ability to take initiative to identify and resolve issues with a strong balance of strategic leadership and “hands-on” direction when needed.
KEY TASKS & RESPONSIBILITIES:
1. Responsible for the management of the Process and Manufacturing Engineering staff for generation and support of manufacturing processes, including procedures, equipment and training of production staff.
2. Responsible for the direction and supervision of the Process and Manufacturing Engineering with regards to training, motivation, development, and staffing.
3. Assists Senior Manager of Process Engineering in establishing policies, procedures, systems, practices and development/control of department/project budgets.
4. Perform project management, planning, scheduling, and resource allocation.
5. Responsible for ensuring that all project specific tasks are staffed with the required skill mix needed to solve complex technical problems such as process optimization.
6. Write project proposals, capital justifications, specifications and operating procedures in support of management and technical leadership responsibilities.
7. Applies extensive management expertise, engineering knowledge and hands-on problem solving skills to lead and facilitate continuous improvement of manufacturing processes.
8. Responsible for leading the optimization of production processes utilizing relevant methodologies such as continuous improvement and root cause problem solving.
9. Responsible for gating the transfer of new product from NPI phase to mass production.
10. Collaborate with materials management and R&D to select technology and suppliers for the manufacture of product components and process equipment for released products to reduce overall costs, improve quality, reliability, and timeliness of deliveries.
11. Responsible for collaborating with the PPD group to review, accept and support the new product processes and equipment for release and introduction into production.
JOB REQUIREMENTS:
1. BS in Engineering; Masters Degree in Engineering preferred.
2. Minimum 8 years working experience in high volume IC assembly environment specialized in Die Attach, Backgring, Wafer Saw process operations.
3. Experience in memory assembly is a major plus.
4. Minimum of 2 years experience in management and 4 years experience in technical leadership of engineering staff.
ROLE PURPOSE:
Expert in Wire Bond process for yield improvement & cost reduction. To guide engineers & provide solutions on process problems using analytical and engineering approach.
KEY TASKS & RESPONSIBILITIES:
1. Able to lead a team of engineers with coaching and guiding engineers/technicians.
2. Leading, driving and initiating improvement activities (yield & cost reduction) with cross functional team in Wire Bond.
3. Guiding engineer on trouble shooting with DOE approach, problem solving, report writing & presentation skills.
4. Interaction with customers.
5. Buildsheet & design review.
6. Champion for all wire bond issues that cannot be solved in line level.
7. Provide support on project initiated by others.
JOB REQUIREMENTS:
1. PhD/Master Degree/Bachelor Degree in Material Science, Applied Physics, Mechanical Engineering or related engineering discipline.
2. Master Degree with over 3years or Bachelor Degree with over 5years working experience in related process in high volume semiconductor manufacturing environment.
3. Strong experience in Wire Bonding Process (Au & Copper wire)
4. Familiar K&S, ASM, ESEC & Shinkawa wire bonder
5. Experience with gold wire
6. Experience with copper wire.
FOL mgr--DA
ROLE PURPOSE:
1. To lead the Assembly Process Engineering team (FOL1: Die Attach, Backgring, Wafer Saw, Flip Chip) to support production and improve yield, quality, productivity and reduce cost. To direct the engineering team to provide solutions on process problems using analytical and engineering approach.
2. The successful candidate should be a committed professional and leader with the ability to work in a fast-paced environment and meet urgent deadlines. They must be a self-starter with the ability to take initiative to identify and resolve issues with a strong balance of strategic leadership and “hands-on” direction when needed.
KEY TASKS & RESPONSIBILITIES:
1. Responsible for the management of the Process and Manufacturing Engineering staff for generation and support of manufacturing processes, including procedures, equipment and training of production staff.
2. Responsible for the direction and supervision of the Process and Manufacturing Engineering with regards to training, motivation, development, and staffing.
3. Assists Senior Manager of Process Engineering in establishing policies, procedures, systems, practices and development/control of department/project budgets.
4. Perform project management, planning, scheduling, and resource allocation.
5. Responsible for ensuring that all project specific tasks are staffed with the required skill mix needed to solve complex technical problems such as process optimization.
6. Write project proposals, capital justifications, specifications and operating procedures in support of management and technical leadership responsibilities.
7. Applies extensive management expertise, engineering knowledge and hands-on problem solving skills to lead and facilitate continuous improvement of manufacturing processes.
8. Responsible for leading the optimization of production processes utilizing relevant methodologies such as continuous improvement and root cause problem solving.
9. Responsible for gating the transfer of new product from NPI phase to mass production.
10. Collaborate with materials management and R&D to select technology and suppliers for the manufacture of product components and process equipment for released products to reduce overall costs, improve quality, reliability, and timeliness of deliveries.
11. Responsible for collaborating with the PPD group to review, accept and support the new product processes and equipment for release and introduction into production.
JOB REQUIREMENTS:
1. BS in Engineering; Masters Degree in Engineering preferred.
2. Minimum 8 years working experience in high volume IC assembly environment specialized in Die Attach, Backgring, Wafer Saw process operations.
3. Experience in memory assembly is a major plus.
4. Minimum of 2 years experience in management and 4 years experience in technical leadership of engineering staff.
公司介绍
团队介绍
联系方式
- 公司地址:上班地址:朝阳区将台路