南京招聘

1.In this position, the individual will optimize the process specification in Burn in and memory test area and document the work instructions in burn in and memory test. The individual will drive low yield category to detail department, OCAP/FMEA documentation for MT area, and SPC control setup/follow up for yield. Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication, and evaluation of semiconductors. Reviews product requirements with design staff to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts and approaches in the processing or development of new or improved processes in photomasking, diffusion, deposition, wafer fabrication, and device physics.

2.This position requires a BS/BA degree or equivalent with 3 or more years of related experience. The ideal individual must have proven ability to achieve results in a fast moving, dynamic environment. Self-motivated and self-directed, however, must have demonstrated ability to work well with people. A proven desire to work as a team member, both on the same team and outside of the team. Ability to troubleshoot and analyze complex problems. Ability to multi-task and meet deadlines. Excellent communication (written and verbal) and interpersonal skills.

DB Talent is a European based recruitment company. Our Shanghai office opened in the 2001, and we have continually provided excellent professional service to our clients and candidates.