南京招聘

Responsibilities:

1. Interface with external foundry and internal design/Operation/PMO/Sales groups;

2. Study design manual of different foundry & tech node, base on device list and GDS list to calculate mask quantity, provide exact information to purchase team for quotation reference.

3. Handle tape out activities without delay and mistake, do job view, define corner split, trace and pull in lot schedule, review WAT, keep NTO succeed.

4. Support internal Design/ Sales/Purcharse team to do new Fab and new process survey for pre sales cases. Attend foundry symposium, and collect newest tech node progress.

5. Working with external foundry and internal engineer team to resolve wafer manufacturing technical issue, during new tape out stage, risk run stage and mass production stage, keep doing yield improvement, handle Foundry inline excursion, PCN, RMA etc.

6. Apply PDK/Library/ Foundry IP/tech files per project needs, manage multi foundry accounts.

7. Hold periodic meeting with foundry for technical topics. Arrange QBR/QTR.

8. Support internal QA team solve foundry related quality problems, attend foundry audit.

 

Requirement:

1. Degree of Bachelor or above in engineering field, major in EE is preferred

2. At least 3 years' work experience, and minimum 2 years' foundry Process/Integration/Device working experience; 65/55/40/28/14/10/7nm or below & tape out experience is a plus.

3. Strong background in processes (<0.18um, FinFET etc), include design rule analysis and validation, DOE, and flow.

4. Able to do yield, inline, WAT correlation check, good data analysis ability with JMP, TANGO etc.

5. Must be carefully and take responsibility. 

6. Self motivated, strong communication and interpersonal skills;

7. Ability to multiplex between a variety of different tasks.

 

芯原微电子（上海）股份有限公司（芯原股份，688521.SH）是一家依托自主半导体IP，为客户提供平台化、全方位、一站式芯片定制服务和半导体IP授权服务的企业。在芯原芯片设计平台即服务（Silicon Platform as a Service, SiPaaS）经营模式下，通过基于公司自主半导体IP搭建的技术平台，芯原可在短时间内打造出从定义到测试封装完成的半导体产品，为包含芯片设计公司、半导体垂直整合制造商(IDM)、系统厂商和大型互联网公司在内的各种客户提供高效经济的半导体产品替代解决方案。我们的业务范围覆盖消费电子、汽车电子、计算机及周边、工业、数据处理、物联网等行业应用领域。

芯原拥有多种芯片定制解决方案，包括高清视频、高清音频及语音、车载娱乐系统处理器、视频监控、物联网连接、数据中心等；此外，芯原还拥有6类自主可控的处理器IP，分别为图形处理器IP、神经网络处理器IP、视频处理器IP、数字信号处理器IP、图像信号处理器IP和显示处理器IP，以及1400多个数模混合IP和射频IP。

芯原成立于2001年，总部位于中国上海，在中国和美国设有6个设计研发中心，全球共有11个销售和客户支持办事处，目前员工已超过1300人。