南京招聘

职位描述：
As a product engineering group (PEG) member, you will act as a technical liaison between customers and R&D. You will be responsible for: product feasibility study, new feature& improvement request definition, provide technical support to the field application engineers and customers. This role requires the individual to work between various organizations and play a key role in shaping and directing product growth and development.
Roles /Responsibilities:
? Collect product request from external and internal users, write PRD(product request document), cross team communication among R&D team, SQA team and Product team
? Perform new functionality feasibility study and prototype testing
? Play a key role in product qualification testing and provide evaluation reports based on customer's requirements,
? Perform world-wide customer support and participate in customer engagement activities, some travel within Asia is required.
? Create technical documentation for special applications and their best practice usage
Job requirements:
? Master or Ph.D. degree graduating from top universities, with solid knowledge in mathematics or physics or optics or EE
? Basic knowledge of software engineering and computer programming
? A good team player with strong interpersonal skills
? Excellent communication and presentation skills
? Fluent English speaking and writing skills
Experience
? 1.5~4 years’ experience in related field(EDA, Foundry)
? Knowledge of image processing or digital signal process is a plus.
? Script level programming skill at least, higher skill level is preferred.
? Experience with lithography, or simulation tools is preferred.
? Experience with scanners and(or) metrology tools, or IC manufacturing process is preferred.
Desired but not required:
? Familiarity with UNIX environment, C/C++, , databases
? Solid training and knowledge in mathematics or optics or physics
? Knowledge or work experience in semiconductor lithography, semiconductor manufacturing, mask data preparation, metrology inspection, yield improvement, litho process, etch process, FAB process tuning and control

总部位于荷兰的阿斯麦(ASML)是全球芯片光刻设备市场领导者，许多热门电子产品都有采用 ASML 设备制造的芯片。ASML的愿景是通过我们的技术来驱动人类更好的生活质量。ASML在全球16个国家设有60个办公室，员工超过25,000人。ASML在中国的员工超过1000人，于上海、北京、天津、大连、武汉、西安、无锡、南京、合肥、厦门等12个城市设有客户支持办公室，此外在深圳设有计算光刻软件研发中心(Brion)，北京有量测设备研发中心（HMI），为中国地区的客户提供全方位光刻解决方案。

Brion(睿初科技)成立于美国硅谷，是全球“计算光刻”技术的提出者和领导者,其核心是利用计算机集群软件计算技术，通过建模、仿真、数据分析和优化等手段解决半导体制造过程中的纳米级掩膜修复、芯片设计/制造缺陷检测与矫正等难题。HMI（汉民微测科技）成立于美国硅谷，是全球先进半导体制程“图像验证系统”的领导者，以优秀的跳跃式扫描检测及稳定的电子枪技术闻名世界。两家企业分别与2007年和2016年与ASML 实现战略合并，通过三方的技术衔接与创新，为全球知名半导体制造商提供全光刻解决方案。

ASML致力于为员工打造优良工作环境，让全球优秀的工程师乐于在此工作、交流、学习和分享。ASML开放、尊重与创新导向的企业文化，不仅促进员工与同侪及主管间的率直讨论、相互学习，更让ASML能够持续维持技术领先优势。ASML 提供的是一条长远的职涯规划，让公司同仁能在一个重视永续学习的企业文化和优渥的福利环境中工作成长。