南京 [切换城市] 南京招聘南京工程/机械/能源招聘南京技术研发经理/主管招聘

封装经理

苏州高特服务外包有限公司

  • 公司规模:150-500人
  • 公司性质:民营公司
  • 公司行业:专业服务(咨询、人力资源、财会)

职位信息

  • 发布日期:2017-04-09
  • 工作地点:上海-浦东新区
  • 招聘人数:2人
  • 职位月薪:2.5-3万/月
  • 职位类别:技术研发经理/主管  项目经理/主管

职位描述

职位描述:
JOB SUMMARY:
 
This is a technical position in factory RnD department. The qualified candidate is responsible for semiconductor assembly technology development till mass production to support customer requirement and factory needs. He or she need lead the project team members and work with customer and business unit people in US or other country to assess the project risk, define the project schedule and come out risk mitigation plan, DOE evaluation and solution implementation to make sure the project can meet both quality and schedule requirements.
该职位是在工厂的研发部,合适候选人主要负责从半导体封装技术到量产来支持客户和工厂的要求.
他需要领导项目成员和在美国总部的事业部伙伴和客户来评估项目风险,指定项目的进程和减轻项目风险,
并进行DOE评估和方案执行来确保项目既符合质量和进程的要求。
 
______________________________________________________________________________________
 
Duties & Responsibilities:
% Of Time
1.
Responsible for leading development team for new product development project
60%
 
planning through TRA, schedule planning and project execution. Make sure the project
 
technical risk and schedule risk can be mitigated and all issues can be resolved with good
 
quality and timely manner.
 
他需要领导项目成员来通过TRA,进程计划和项目执行来进行新项目导入,确保项目技术和进程风险最低,并确保所有问题项目既符合高质量和及时进程的要求。
 
2.
Communicate with customer and BU and review project status, issues and plans
和客户和事业部进行交流来评估项目的进程和计划
20%
3.
Make sure the required development documents generated with good quality
确保项目所需高质量的研发文件
15%
4.
Communicate with factory peers and management to get sufficient support
和工厂的同事联系来得到足够的支持
5%
 
____________________________________________________________________________________
 
Number of Employees Supervised: 1~10
 
Travel Required: Domestic 5% International 5%
____________________________________________________________________________________
 
Qualifications:
 
Education/Knowledge: Preferably bachelor degree in mechanical, materials, physics or related education and above.
机械,材料,物理或相关的本科或以上背景
 
Experience: Need >8 years’ experience in semiconductor assembly process engineering, experience on SCSP and SMT is good plus
 
8年以上半导体封装工艺工程经验,有SCSP和SMT尤佳
External & Internal Contacts: Customers, BU, TPM, Designer, Process Engineer, Equipment/Maint engineer, Production controller, Quality, IE, HR and Equipment & material suppliers.
和工厂的内外部各个部门沟通
 
Special Skills or Qualifications that are helpful: Fluent English reading, writing and speaking, Project management skill, Problem solving skill, statistical knowledge and SW application skills, good communication skill.
英语口语流利,项目管理经验,问题解决能力,统计知识和软件应用能力和良好的沟通能力

职能类别: 技术研发经理/主管 项目经理/主管

关键字: 封装 BGA SIP Flip chip 半导体 NPI

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公司介绍

     苏州高特人力资源有限公司从事人力资源外包服务,中高级人才寻访与推荐的专业化人力资源有限公司,我们的主要服务对象为制造业的跨国公司和本土制造、研发和服务行业的各类优秀企业。

     作为专业从事人力资源研发、咨询与服务的公司,我们依托政府和劳动部门的支持,对人力资源市场供求关系和发展趋势进行系统分析和深入研究,凭借务实的管理风格,简化的工作流程, 进行人力资源的综合开发和有效利用,为客户提供全面、专业的人力资源服务,解决企业用人的后顾之忧。

     公司地址:苏州市桐泾商务广场

联系方式

  • 公司地址:上班地址:河北固安