模封设备工程师 Molding Equipment Engineer
深圳南山安森美半导体有限公司
- 公司规模:500-1000人
- 公司性质:外资(欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2015-04-09
- 工作地点:深圳-南山区
- 招聘人数:1
- 工作经验:3-4年
- 学历要求:本科
- 职位月薪:面议
- 职位类别:半导体技术
职位描述
Job description:
1. Make sure machine under safety condition without injure and fire risk;
2. Work out PM content by PM document;
3. Build up PM schedule and implement basing on PM document;
4. Prepare training material and implement training to improve Line Tech competency;
5. Work out AM content, and Line Tech will implement regularly;
6. Spare pare prepare and localization to drive down maintenance cost;
7. Continuous to improve machine performance in terms of safety, UPH, quality, etc;
8. Critical spare parts change management.
9: Familiar with EFMEA/TPM/RCM system
Requirement
1: BS or above, equipment engineering background.
2: Good at writing and reading English.
3: 5 years or above work experience in semiconductor assembly field,
3: familiar with B/E equipment, including molding/deflash/water jet/plating.
公司介绍
公司位于深圳市南山区西丽留仙洞第三工业区。目前员工人数近900人。我们公司以绩效为本,致力于实现有盈利的增长和世界级业绩,贯彻基准质量,为客户及股东创造卓越的价值。
联系方式
- 公司地址:地址:span深圳市南山区西丽街道西丽镇留仙村路110号