乐山招聘

职位描述：
1、JOB OBJECTIVES / SUMMARY
· To ensure engineering capability is established at supplier site during outsourcing process before the start of serial production.
· To drive the improvement and solving of modules abnormalities found during FAI, EVT & pre-production
· Be the technical expert and know how transfer of assembly instruction & test procedure, tester units, jigs & fixtures to suppliers
· 1st level support for CMO suppliers on engineering related issues
· On-site support during the first 2-3 batches of serial production
· Continuous process improvement at supplier site
· Monitor closely the quality performance of the CMO suppliers and ensure smooth phase in/phase out after EVT and HAO to OP SQE.
   2、MAIN DUTIES AND RESPONSIBILITIES
· To assess the engineering capabilities of Complete Module Outsourcing (CMO) supplier via qualification or process audit.
· To support Product Qualification Assessment & Process Readiness Audit in order to qualify the suppliers, module readiness and identify areas for improvement. Drive suppliers to close the open issues from audit before series production.
· Define the critical parts and FAI list to supplier. Drive supplier to solve technical and quality issues during FAI, EVT & pre-production.
· To conduct technical meetings on regular basis with CMO suppliers and stakeholders.
· To be on site support during EVT build including the first 2-3 batches of serial production to ensure meeting first pass yield during EVT and incoming module rejection rate.
· Close follow-up with suppliers and relevant stakeholders to ensure all the critical activities and technical support during supplier qualification, FAI, EVT and series production are on track as per schedule.
  3 、JOB REQUIREMENTS
(Qualification / Education / Years of experience)
· Bachelor in mechanical engineering, electronic engineering, or equivalent with at least 3-5 years of related working experience
· Prefers those with background from semiconductor back-end assembly processes specifically related to die attach or packaging
· Knowledge of machine assembly & testing, ISO quality system, Lean Sigma, Kaizen, and quality tools are essential for this job.
  4、 TECHNICAL COMPETENCIES REQUIREMENTS
(Task based)
· Advance skill in sub-module/module/system assembly/ Application
· Knowledge in die attach, die bonding, die sorting, molding, or singulation; eg. ESEC, Datacon, Fico, Meco machines
· Good knowledge of electrical parts & components
· Good knowledge of mechanical parts & components.
· Understanding of machining process & ability to improve method
. Advance knowledge of components ( Pneumatic , Mechanical , Electrical )
· Understanding of technical drawings ( Pneumatic , Mechanical , Electrical )
. Knowledge of trouble shooting and analytical skill
· Familiar with common QC inspection and measurement equipment
· Well verse in geometrical and dimensional tolerance (GDT)
   5、 NON-TECHNICAL COMPETENCIES REQUIREMENTS
(Skill based)
· Good Communication skills (with peers & superiors & suppliers)
· Project coordination skills
· Problem solving & Negotiation skills
· Interpersonal skills
· Leadership skills
· Time management skills
· Training/ coaching skills
· Ability to plan and optimize the resources
· Common application software
   6、 ENVIRONMENTAL COMPETENCIES REQUIREMENTS 举报 分享

    乐山博思半导体有限公司（原：乐山飞舸模具有限公司），成立于2002年7月，是由世界顶尖的半导体精密模具及设备制造商荷兰比尔半导体工业公司，与中国最大的分立器件制造商乐山无线电股份有限公司共同合资兴建的中外合作企业，由荷兰方进行管理，是在乐山高新区正式投产的第一家外资企业。
    博思集团总部位于荷兰，在荷兰、瑞士、奥地利、美国、韩国、马来西亚、新加坡、台湾以及中国各大城市分别设有研发、销售、生产基地，在阿姆斯特丹上市。
    乐山博思主要设计和制造微米标准的精密模具，其产品主要用于半导体工业。我们的产品主要出口欧洲，客户遍及中国大陆，台湾，东南亚，中东。乐山博思始终秉承“为客户提供质量和可靠性极佳的精密模具”的经营理念，在十五年的发展过程中，不断引进荷兰Besi的先进技术，设备和管理经验，实现了产品终检”零不良”，公司效益逐年提升。我公司的模具产品不仅在国内外客户中享有良好的声誉，而且产品的价格也具有明显优势。
    乐山博思自成立以来，连年获得乐山市高新技术开发区“优秀外资企业”称号，公司自行研制和开发的AMSI/BGA&AMS-W自动模具获得了省、市科技成果鉴定证书。2004年公司通过了ISO9001和ISO14001认证。现在，乐山博思己成为全球半导体模具制造行业的领袖，以顶尖的设计和工艺闻名。
    乐山博思生产车间采用了和荷兰博思相同的装备，机器和系统。先进的机器设备使我们的模具产品成为了中国最先进的模具产品之一。高端的机器设备有，如：瑞士阿奇夏米尔(AgieCharmilles)电火花成型机、线切割机床、瑞士FEHLMANN CNC电极铣床、德国JUNG CNC、精密平面磨床、CNC加工中心、投影仪、平面粗糙度测量仪等各种精密设备及仪器，质量检测系统采用了MITUTOYO制造的最精密的三坐标测量仪。公司十分重视员工技能培训，关键技术岗位人员都曾派往海外，接受荷兰博思技术人员的专业培训。
    为了扩展公司业务，拓宽产品市场，2015年6月我公司从马来西亚引进一条新的生产线，专业从事芯片贴片机设备制造，该设备主要应用于半导体集成块芯片。新生产线的引入标志着我公司的生产能力及业务水平跨上了一个新的台阶。经过两年时间发展，不断派遣员工出国培训学习以及外籍技术员往来交流，我公司已经能独立生产，测试，校准多种机型。
    风雨兼程，一路走来，博思半导体历经了整整十五个春秋，乐山博思员工携手同心，共同努力，十五年里我们取得了令人瞩目的成绩。拼搏进取铸就辉煌，相信在未来的岁月里博思半导体必将谱写出更加华丽的篇章！


公司地址：四川省乐山市高新区迎宾大道8号
联系电话：0833-2596385-153
传真：0833-2596368
电子邮件：juno.zhu@besi.com；info.leshan@besi.com
联系人：朱小姐