Molding Technician
星科金朋(上海)有限公司STATS ChipPAC
- 公司规模:1000-5000人
- 公司性质:外资(非欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2015-04-25
- 工作地点:上海-青浦区
- 招聘人数:若干
- 工作经验:二年以上
- 学历要求:中专
- 职位类别:半导体技术
职位描述
Job Responsibilities:
§ Provide line support of highly automated equipment in high volume production environment.
§ Adjusts, repairs and, repair and trouble – shoots machine failures so that machines can be running smoothly.
§ Perform periodic calibration, preventive maintenance of equipment base on equipment maintenance schedules/specifications.
§ Help supervisor tracking the performance of equipment and take necessary actions to improve the performance
§ MC potential risk analysis and continue improvement ability.
§ Support Supervisor of training/skill improve of line ME.
Job Requirements:
§ Good teamwork and communication skill.
§ Good English read/write/speak, office/windows software skill.
§ Two or more years of working experience on Molding equipments of relevant processes in semiconductor assembly and test industry.
§ Graduate in related industries College diploma or Mechanics, Electronics specialty.
公司介绍
星科金朋(上海)有限公司位于上海西郊经济技术开发区,距虹桥机场仅8公里之遥,现有员工三千多人,占地面积11万平方米。公司提供定期和不定期的员工海外培训机会,为员工的发展提供广阔的平台。
公司将根据资历和相关工作经验对应聘成功者提供具有竞争力的薪金和福利,及相应的国内外培训机会。
凡有意应聘者请将详细的个人简历、学历证书、身份证及有关材料复印件邮寄、电子邮件或传真至本公司(请在信封/Email上注明应聘职位)。
如需获得本公司更多信息,请访问我们的网站。
联系方式
- Email:SCCRecruitment@statschippac.com
- 公司地址:上班地址:江阴技术产业开发区长山路78号