合肥招聘

职位描述：
Package Engineer
Responsibility:
？ Responsible for providing total package solution on BGA, QFN, QFP & FCBGA packages
？ Responsible for substrate design release and electrical / thermal simulation result recognition
？ Manage production issues in subcontractors
？ Working together with product/test/quality engineers to improve production yield
？ Maintain and develop resource to support new prototype samples
？ Price negotiation with suppliers
？ Other jobs assigned by department supervisor

Qualification:
？ M.S. or B.S. degree in engineering
？ Over 5 years’ hands on experience at package house or fabless (subcontractor operation)
？ Strong background on package development on BGA/QFP/QFN packages
？ Experience in package process and yield improvement activities
？ Ability on package feasibility study on substrate layout and bond ability check
？ Familiar with SIP products
？ Good mentoring, communication, presentation skills and team work
？ Strong data analysis and technical problem solving skills

Preferred qualification:
？ Experience on substrate layout
？ Experience on package level electrical simulation
？ Ever work background on wire bonding, especially on copper / alloy wires
？ Project management or NPI experience 举报 分享

合肥灿芯科技有限公司是由灿芯半导体和合肥政府在2016年合资成立，定位于130nm/90nm以下的高端设计服务与Turn-Key服务，为客户提供从源代码或网表到芯片成品的一条龙服务。
灿芯半导体是中国最大的SoC和ASIC设计服务公司之一，由中芯国际集成电路制造有限公司投资。