东莞 [切换城市] 东莞招聘东莞电子/电器/半导体/仪器仪表招聘东莞电子技术研发工程师招聘

先进封装技术工程师/Advanced packaging engineer

晟碟半导体(上海)有限公司

  • 公司性质:外资(欧美)
  • 公司行业:电子技术/半导体/集成电路

职位信息

  • 发布日期:2016-10-15
  • 工作地点:上海
  • 招聘人数:1人
  • 工作经验:8-9年经验
  • 学历要求:本科
  • 职位月薪:15000-19999/月
  • 职位类别:电子技术研发工程师  

职位描述

职位描述:
General Competencies

Good knowledge on Fan In, Fan Out or Flip Chip Product Process, Development procedure and Quality Control.

Good knowledge on Wafer Fab Process, Development procedure (Coating, Lithography, Development, Etching, Strip, etc.) and Quality Control.

Good knowledge on Substrate Manufacturing Process, Development procedure (Coating, Lithography, Development, Etching, Strip, etc.) and Quality Control.

Good knowledge on Failure Analysis (electrical and physical) and Investigation with close loop.

Have good knowledge for measurement system introduction and analysis.

Familiar on Quality system, ESDA, MSA, SPC, DMAIC, FMEA, JMP, etc.

Ability to achieve results in a fast moving, dynamic environment.

Ability to troubleshoot and analyze complex problems.

Ability to multi-task and meet deadlines with team work.

Open mind and positive communication with In-time feedback.

Good Adoptability and Agility with fast changing environment.

Self-motivated and self-directed, however, must have demonstrated ability to work well with people.

A proven desire to work as a team member, both on the same team and cross team.

Willingly creative and exceed.

Excellent English communication (written and verbal) and interpersonal skills.

Requires BS/BA degree or above.

Job Description

Work with team to make sure the program meeting target quality and schedule.

Measurement system introduction and Measurement Instruction initialization/update.

Conduct Failure Analysis (electrical and physical) and lead team to do investigation with close loop.

Competitor Analysis and industry benchmark for advanced product, process, material, etc.

Engineering support for new platform, new technology program and new package development.

Package Level and Board Level Reliability test, failure analysis and investigation with close loop.

Work with wafer Fab and wafer vender for Device level failure analysis.

Host project and program for advanced new PlatForm, Technology, Process, Material and Equipment.

职能类别: 电子技术研发工程师

举报 分享

公司介绍

西部数据推动数据繁荣,缔造辉煌成就。无论在手机、云端抑或各个组织中,凡是数据所及之处,我们都在日复一日地推动必要的创新。无论是设备、系统、解决方案还是数据结构,我们都在不断进行着优化和调整,以期为充分发挥数据潜力创造合适的条件。

西部数据创新的技术和解决方案能帮助用户创建、保存、获取和改变日益增加的数据多样性。作为业内领先的解决方案提供商,我们有责任为重视数据的用户和系统提供更好的使用体验。西部数据公司以数据为中心的解决方案在WD,闪迪,G-Technology,Tegile和Upthere品牌下进行销售。

联系方式

  • Email:sdss@Sandisk.com
  • 公司地址:上海市闵行区江川东路388号 (邮编:200241)