Sr.Packaging Des Engineer/高级封装设计
晟碟半导体(上海)有限公司
- 公司性质:外资(欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2015-02-12
- 工作地点:上海-闵行区
- 招聘人数:1
- 工作经验:5-7年
- 学历要求:本科
- 语言要求:英语精通
- 职位月薪:面议
- 职位类别:半导体技术
职位描述
Description:
1. Substrate design review
2. Design flow enhancement
3. Design library maintenance
4. Design rule collection and maintenance
5. Coordinator of subcon/substrate supplier related to substrate design
6. Substrate Strip Design
7. Substrate supplier Gerber file review
8. Tooling Design/Review"
Requirement:
"1. Good knowledge on Packaging engineering and designing.
2. Good knwoledge on computer, windows, office, Understand CADENCE, CM350, CAD, SOLIDWORD 3D DWG related soft ware.
3. Ability to achieve results in a fast moving, dynamic environment.
4. Ability to troubleshoot and analyze complex problems.
5. Ability to multi-task and meet deadlines.
6. Excellent English communication (written and verbal) and interpersonal skills.
7. Willingly creative." "Execute substrate design including LGA, BGA and new product.
8. Have process and statistical analysis experience.
9. Have team management experience and program management experience.
公司介绍
西部数据创新的技术和解决方案能帮助用户创建、保存、获取和改变日益增加的数据多样性。作为业内领先的解决方案提供商,我们有责任为重视数据的用户和系统提供更好的使用体验。西部数据公司以数据为中心的解决方案在WD,闪迪,G-Technology,Tegile和Upthere品牌下进行销售。
联系方式
- Email:sdss@Sandisk.com
- 公司地址:上海市闵行区江川东路388号 (邮编:200241)