东莞招聘

职位描述

Role & Opportunity:

The responsibilities of this position are focused on specifying, designing (schematic capture, PCB layout , implementing and verifying the motherboard and other various sub-system boards that make up the Surface product. This work includes development of requirements and evaluating different solution for functionality, cost, and risk. The subsystems on the motherboard include (but are not limited to): High speed buses (front side bus, memory bus, PCIe bus, SATA bus, USB bus, I2S, I2C,UART,etc.), memory, Ethernet, Wi-Fi, processors, audio/video, system clocking, power and thermal management, and misc. analog/digital circuitry. The position involves working closely with industrial designers, electrical engineers, BIOS engineer, mechanical engineers, software engineers, test engineers, component engineers, and program managers.

Candidates should be able to apply core electrical engineering hardware and firmware skills to drive detailed problem solving on products within a technical team as well as manage broader industry standards, interoperability and compatibility testing with external development and test partners.

Qualifications:

· Minimum BS in Electrical Engineering or Computer Engineering or related field.

· Minimum of 5+ years’ experience contributing to the design and production of complex products in the electronics industry.

· A solid understanding of core engineering principles, fundamental circuit design, and analytical techniques is required. Familiar with high speed design signal integrity issues, power distribution techniques, system clock & modern processors

· Familiarity with embedded system architectures hardware and software, experience with implementation of high speed serial buses (SATA, PCIe, USB) and/or high speed parallel buses such as: memory bus (DDR2, GDDR3, etc.), CPU front side bus, Hyper transport, and/or voltage regulator/ power delivery design a plus.

· Strong bench evaluation and in-lab debugging skills are required.

· Hands-on board design experience, familiar with design tools including Cadence and Allegro.

· Good understanding of electronic assembly processes

· Conducting detailed failure analysis on mother board and computer external interface; working with manufacturing and engineering teams to put in corrective actions

· Strong communication skills required, including the ability to clearly express technical concepts in verbal and written forms. Will need to communicate with team members is USA.

· Must be able to plan work, and work to a plan adapting as necessary in a rapidly evolving environment.

· Enthusiastic, motivated and self-driven.

· Experience with computer mother board, firmware/UEFI, BIOS or FPGAs desired

· Experience with Cadence desired

· Design for manufacturing and test experience is required. Experience with CDM partners is desirable.

· The ability to comprehend and assimilate technical concepts across multiple disciplines is a plus.

· Domestic and international travel may be required.