东莞招聘

Job Responsibilities:
1. Manage development projects in new package, process and materials. Develop and introduce new products, i.e. new packages, processes, material and equipment qualification, evaluation and characterization.
2. Handle Package Design and development programs and achieves the targets and deliverables. Lead and Facilitate the team members to achieve high performance
3. Actively sharing his knowledge, participates in industrial improvement teams, shares information and best practices.
4. Uses his expertise to advise the fellows on options for cost reductions, reviews and audits production sites on volume manufacturing aspects, reports his findings and makes suggestions for improvements.
5. Subject expert in the area of semiconductors Packaging Technologies, e.g. Assembly Processes & Final Test.
6. Perform operational excellence by applying problem solving tools(TRIZ), statistical analysis (MINITAB) and failure analysis at project execution and manufacturing processes.
7. Good presentation and communication skills in multi-culture environment. Good command of written and spoken English, Cantonese, and Putonghua is preferable.

Job Requirements:
1. Master degree, major in Engineering disciplines. PMP or CAPM certified;
2. Minimum 5 years working experience in moulding process/equipment with hands-on skills; solid exposure in product, process and project management gained from industrial discrete semiconductors backend development and manufacturing. Solid experience in QFN Packaging Miniaturization;
3. Excellent knowledge in statistics, data analysis, quality tools and improvement proposal, project Management and "expert" level knowledge in process, package and materials.
4. Proactive and hands on. Good interpersonal and presentation skills; able to work with minimum supervision and is a team player with cross departments and external parties. Strong customer focus, problem solving skills and project management with the determination to succeed; result-oriented and demonstrate high level of initiative.
5. Good written and average spoken English, good Chinese


Immediately Supervisor: Senior Manager, Process Development
Subordinates: Can be individual contributor, with max 1 or 2 persons in the team

公司介绍:
恩智浦半导体(NXP Semiconductors)是全球前十大半导体跨国企业，公司总部位于荷兰埃因霍温Eindhoven，在全球20多个国家拥有26000名员工，2011年公布的销售额达42亿美元。 恩智浦提供半导体、系统解决方案和软体，为手机、个人媒体播放器、电视、机上盒、辨识应用、汽车以及其他广泛的电子设备提供更优质的感官体验。我们的产品广泛应用于移动通信与个人产品、汽车识别、家用产品及其他应用电子类产品中。我们主要的客户包括飞利浦、富士康、华硕、西门子等知名企业。我们的产品主要通过Arrow、World Peace、AVNET、SAC、及EDAL等世界知名的电子经销商进行销售。
恩智浦半导体广东有限公司 简称APG，前身为飞利浦半导体(广东)有限公司，是由飞利浦电子集团公司创办的中国第一家全独资半导体项目企业，于2000年9月1日正式投产，以背面粘贴式(SOT23、SOD323&523、SOT223、SOT143、MCD)分离式半导体元件为主。恩智浦半导体广东有限公司占地面积约为十万平方米，设有现代化的写字楼、两座生产厂房、餐厅、员工文化娱乐中心、及六座设施齐备的员工宿舍。公司现有雇员4000余名，2010年，我公司的半导体元件产日均产量达到1亿粒，已成为全球最大的半导体生产中心之一。
我们始终坚信团队合作是我们取得成功的***途径，我们还鼓励组织内部的跨职能团队建设。对于恩智浦半导体广东有限公司的全体员工来说，这里不仅仅是工作场所，同时也是一个娱乐中心和发展平台。恩智浦半导体信奉“人是公司最宝贵的资源”的经营理念，为员工提供优越的学习和发展机会。为配合公司的快速发展，我们诚邀各类英才加盟，共创美好未来!
公司福利：
1.五天八小时工作制，按劳动法支付加班费，享有法定假日、婚假、产假、有薪年假(每年年假不少于7日)等带薪假 ；
2.根据国家规定购买五险一金，另额外提供商业医疗门诊保险；
3.公司提供食宿或食宿补贴；
4.年终双薪，及每年最高可达三个月的年度绩效奖金；
5.有定期来往东莞、深圳、广州的免费上下班接送班车；
6.丰富的业余文化生活：设有足球场、篮球场、网球场、乒乓球室、图书馆、阅览室、卡拉ok室及其它娱乐室；
7.强有力的培训支持，统一的核心课程系统。

简历投递邮箱：Maggie.y.wen@nexperia.com