东莞招聘

职责：

1. 基于Advantest T5831/T5833/T5773, Teradyn Magnum, Innotech Smart Tester等多种ATE平台以及公司内部开发的由控制器和固件驱动的测试平台的程序开发

2. 基于设计规格和手册对3D NAND Flash测试方法设计及开发，从首次流片到量产进行失效分析

3. 设计产品专用测试流程并整合以满足量产需求

4. 对设计、工艺、封装发生的问题进行调查并提供解决方案

5. RMA失效模式分析和测试覆盖率提升

6. 平台之间进行测试数据相关性分析

7. 提升良率和降低测试时间

8. 跨多部门合作，诸如PE，DEV，PKG和Design

9. 当有紧急需求情况下，你需要竭力满足项目要求的截止日期

任职资格：

要求：

1. 电子工程、信息系统、计算机科学或相关专业本科及以上

优先：

1. 具备存储测试和测试设计知识，诸如BIST，功能向量，存储修复，IDDQ等等

2. 具有Advantest T5xxx系列存储测试开发相关经验

3. 具有大规模存储量产的ATE 硬件开发经验

4. 具有半导体测试开发相关分析统计的经验

5. 具有专用集成电路, 固件或者嵌入式开发开发经验

6. 具有Java, C/C++或者python开发经验

技能：

1. 良好的问题解决能力

2. 与研发和量产团队的合作沟通能力

3. 良好的自我组织能力

4. 能够制定并满足日程安排的能力

5. 良好的英语口语和书写表达能力

6. 编程技能

ESSENTIAL DUTIES AND RESPONSIBILITIES:

1. Program development on multiple platforms including ADV T5831/T5833/T5773, Innotech Smart Tester, Teradyne Magnum, in house designed platform, driven by controllers and firmware, etc.

2. 3D NAND Flash test methodology design and development according to design specification/datasheets, FA results from the first silicon to HVM.

3. Product specific flow creation and integration to meet HVM requirements. 

4. Engineering investigation and resolution on design/process/packaging issues.

5. RMA failure mode analysis and screen coverage improvements.

6. Test data correlation between platforms. 

7. Yield enhancement and test time optimization. 

8. Collaboration across multiple departments such as PE, DEV, PKG and Design.

9. In house designed platform validation, production environment setup.

10. In case of urgent situation, you need to meet the project deadline as required.

Qualifications

REQUIRED:

1. Bachelor’s degree or above in related field e.g. Electric Engineering, Information Systems, Computer Science.

PREFERRED:

1. Knowledge of Memory test and DFT, such as BIST, functional vectors, Memory repair, IDDQ, etc. 

2. Experience with memory testing on the Advantest T5xxx Experience. 

3. Experience with ATE HW development Experience with high volume production testing of Memory devices. 

4. Experience with ASIC, FW or embedded system development.

5. Experience with statistical analysis in semiconductor test development. 

6. Experience with Java , C/C++ or python program development.

SKILLS:

1. Demonstrable problem-solving skills.

2. Ability to collaborate with R&D and manufacturing engineers.

3. Good self-organization.

4. Able to develop and meet schedules.

5. Excellent verbal and written communication skills are required. 

6. Programming skills

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