东莞招聘

职位描述：
Job Description:
Working with Program team and other Packaging Engineering team to assure the Quality of new Technology Programs and new PlatForms development.
1. PID Quality Control for new wafer technology:
o Thin Die Qual design and validation;
o PID Charz DOE design and validation;
o PID process change related Charz DOE design and validation;
o PID tape out involvement;
o PID design with Lesson Learnt and FMEA;
o PID PNTF, Statistic Design & Analysis, IVT, VECQ, ePPM Score card, Measurement Instruction, Validation, Toll Gate, etc.
2. New Technology Programs Design and Development Quality Assurance:
o TDW/TDS/EDS/MDS, PNTF, CFMEA, VECQ, Measurement Instruction, Statistic Design & Analysis, Toll Gate, Audit, Validation, etc.
3. New PlatForms Design and Development Quality Assurance
o Proposing, Verifying, Ground Rule, PNTF, PF-FMEA, VECQ, Measurement Instruction, Statistic Design & Analysis, Toll Gate, Audit, Validation, DI team, etc.
4. New Packages (retail) Design and Development Quality Assurance
o PDS signature, Recipe Baseline, TDCN, IVT, Toll Gate, etc.
5. TDCN and DCCB review committee.
6. Excursion/Abnormal Control
o RCA, Agile Team, DMAIC, etc.
7. Competitor Analysis for new Technology and PlatForm
o Flip Chip, Fan In/Out, 3D NAND, High capacity PKG, etc.
8. Charz Analysis
o FIB/SEM/EDX/3D X-ray/TEM/X-section/etc.任职资格Requirements:
? Master degree or above in Microelectronic science and technology or Material science and technology or Mechanical engineering or Electrical Engineering.
? English communication skills: CET-4 or above, be fluent both in oral and written English.
? Basic understanding of assembly process flow & materials and wafer fabrication processes.
? Basic knowledge of operation principle for NAND/DDR/ASIC.
? Basic Computer & Microsoft Office skills are required, AutoCAD/Cadence/JMP are preferred.
? Be capable of analyzing SEM/FIB/TEM/EDX results, operating is preferred.
? Ability to achieve results in a fast moving, dynamic environment.
? Ability to troubleshoot and analyze complex problems.
? Ability to multi-task and meet deadlines with team work.
? Open mind and positive communication with In-time feedback.
? Good Adoptability and Agility with fast changing environment.
? Self-motivated and self-directed, however, must have demonstrated ability to work well with people.
? A proven desire to work as a team member, both on the same team and cross team.
? Willingly creative and exceed.
? Excellent English communication (written and verbal) and interpersonal skills.
Be capable of occasionally over time work and oversea business travel. 举报 分享

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