Package Development Engineer(分立器件封装）
瑞能半导体有限公司
- 公司规模：150-500人
- 公司性质：合资
- 公司行业：电子技术/半导体/集成电路
职位信息
- 发布日期：2017-02-21
- 工作地点：上海-闸北区
- 招聘人数：1人
- 工作经验：10年以上经验
- 学历要求：本科
- 职位月薪：1.5-2万/月
- 职位类别：半导体技术
职位描述
职位描述：
Duties & Responsibilities:
Be responsible for the introduction of new packages to facilitate the introduction of more complex products requiring package innovation, both in prototype development phase and industrialization/volume production phase. Examples include Woodbridge project where a combination of Power and IC chips as well as passive components need to be assembled in one package, and future module packages for IGBTs or thyristors.
Qualifications and Competence:
It is expected that the applicant will have been educated to degree or equivalent level, with a minimum of 5 years’ relevant working experience in package innovation, preferably with Power Semiconductors, with proven record of conducting successful large-scale experiments and introduction of new products. He/She must have a very good grasp of the Back-end technology used in assembly of semicconductors, including SIPS (systems in package) technology. He/she need to demonstrate an ability to innovate and apply new ideas to assembly. Good communications and team working ability are also essential for this role.
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Duties & Responsibilities:
Be responsible for the introduction of new packages to facilitate the introduction of more complex products requiring package innovation, both in prototype development phase and industrialization/volume production phase. Examples include Woodbridge project where a combination of Power and IC chips as well as passive components need to be assembled in one package, and future module packages for IGBTs or thyristors.
Qualifications and Competence:
It is expected that the applicant will have been educated to degree or equivalent level, with a minimum of 5 years’ relevant working experience in package innovation, preferably with Power Semiconductors, with proven record of conducting successful large-scale experiments and introduction of new products. He/She must have a very good grasp of the Back-end technology used in assembly of semicconductors, including SIPS (systems in package) technology. He/she need to demonstrate an ability to innovate and apply new ideas to assembly. Good communications and team working ability are also essential for this role.
职能类别： 半导体技术
公司介绍
WeEn Semiconductors Co. Ltd.is the global joint venture between NXP Semiconductors B.V. and Beijing JianGuang Asset Management Co. Ltd. (JAC Capital).
The company’s holding is registered in Nanchang, the capital of Jiangxi Province. Business operations officially began in January 2016 and the operational headquarters located in Shanghai and the company’s wholly-owned subsidiaries and branches including: the front-end fabrication in Jilin, north east China, the warehouse and distribution center in Hong Kong and research and development centers in Shanghai and Manchester, UK. WeEn also has sales offices set up and customer service access throughout the world. In Sep 2018, WeEn has also opened its new, in-house, reliability and failure analysis laboratory in Nanchang, Jiangxi Province.
With a heritage of over 50 years, WeEn is a key player in the semiconductor industry and has focused on developing a wide and deep portfolio of industry-leading bipolar power products including thyristors - consisting of silicon controlled rectifiers and triacs -, silicon power diodes, high voltage transistors and silicon carbide diodes. All these products are widely used in the markets for telecommunications, computers, consumer electronics, intelligent home appliances, lighting, automotive and power management applications. The aim is to help our customers achieve higher cost efficiency and production efficiency and to contribute to the development of China and global intelligent manufacturing.
The company’s holding is registered in Nanchang, the capital of Jiangxi Province. Business operations officially began in January 2016 and the operational headquarters located in Shanghai and the company’s wholly-owned subsidiaries and branches including: the front-end fabrication in Jilin, north east China, the warehouse and distribution center in Hong Kong and research and development centers in Shanghai and Manchester, UK. WeEn also has sales offices set up and customer service access throughout the world. In Sep 2018, WeEn has also opened its new, in-house, reliability and failure analysis laboratory in Nanchang, Jiangxi Province.
With a heritage of over 50 years, WeEn is a key player in the semiconductor industry and has focused on developing a wide and deep portfolio of industry-leading bipolar power products including thyristors - consisting of silicon controlled rectifiers and triacs -, silicon power diodes, high voltage transistors and silicon carbide diodes. All these products are widely used in the markets for telecommunications, computers, consumer electronics, intelligent home appliances, lighting, automotive and power management applications. The aim is to help our customers achieve higher cost efficiency and production efficiency and to contribute to the development of China and global intelligent manufacturing.
联系方式
- 公司地址：中关村