东莞招聘

职位描述：
工作职责
1.在产品开发过程中作为客户的主要工程接口；
2.负责按时交付产品；
3.促进风险管理；
4.向客户沟通现状和问题；；
5.了解技术问题并帮助他们解决；
6.与供应商合作推动材料支持工程建设；
工作要求：
1.本科学历，机械/电子/工业工程或物理专业；
2.至少5年以上的集成电路封装和装配工作经验，其中2年以上团队领导或经理经验；
3. 有相关SMT贴片、倒装芯片底部填充、成型、装配切割和溅射等工艺经验；
4.关键思维和解决问题的能力，并能规划/组织/决策；
5.出色的倾听/演讲/沟通技巧；
6.流利的中英文。

Engineering Project Manager
Responsibility:
1.Serving as the primary engineering interface with customer during product development;
2.Responsible for delivering products on schedule;
3.Facilitating risk management;
4.Communicating status and issues to customer;·
5.Understand technical issues and drive them to closure;
6.Work with vendors to drive material to support engineering building;
Requirement:
1.BS degree ME/EE/IE or physics required
2.At least 5+ years of experience in IC packaging and assembly including 2+ years as a team lead or manager;
3.Experience in assembly process including SMT, die attach, flip chip, underfill, molding, singulation and sputtering;
4.Critical thinking and problem solving skills ; Planning and organizing ; Decision making ;
5.Exceptional listening, presentation and communication skills
6.Fluent in English and Chinese 举报 分享

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