Mobile FAE-Packaging Specialist
美光半导体咨询（上海）有限责任公司
- 公司规模：500-1000人
- 公司性质：外资(欧美)
- 公司行业：电子技术/半导体/集成电路
职位信息
- 发布日期：2016-10-25
- 工作地点：深圳-福田区
- 招聘人数：若干人
- 工作经验：8-9年经验
- 语言要求：英语 熟练
- 职位类别：FAE 现场应用工程师
职位描述
职位描述：
Job Title: Mobile FAE - Packaging Specialist
Degree Required:
Academic Discipline(s):
Experience Required:
Location: BSEE / BSME or equivalent foreign education
Engineering discipline
5-10years of experience developing SMT processes and establishing packaging specifications
Shenzhen, Shanghai, Beijing
Job Description:
As a Field Application Engineer – Packaging Specialist at Micron Technology, you will be in a customer facing engineering role representing Micron’s Packaging expertise. The initial role will be focused on mobile OEMs and may expand to cover other market segments in future. Your role is to be the primary contact with OEMs and ODMs that are working on integrating Micron’s products into their phones. You will be expected to establish a relationship with the packaging engineers and phone manufacturing engineers at the customers, discuss their requirements and work with them in understanding and tuning their SMT processes. You will also be interfacing with Micron assembly engineering, packaging R&D and Business Unit teams to feed customer packaging requirements into product development.
Responsibilities:
? Ensure smooth integration of Micron products into OEMs in the area of SMT and packaging, to secure Design Wins.
? Be the packaging technical advisor to customers on behalf of Micron to determine best practices
? Manage customer issues when they see failures related to packaging, be the technical debug expert in the field to advise customers and to work with internal FA teams.
? Provide technical engagement with other organizational partners to ensure customer approach, deliverables, and priorities are being met
? Influence both internal and external customers and partners on package development and integration to enable successful high-volume manufacture of Micron products
? Maintain knowledge in the areas of reliability and environmental systems, including Moisture, ESDs, Thermal, BLR, and Handling
? Maintain and develop knowledge of how systems are integrated, including SMT, insertion technologies, handling, heat sink attach, design, and materials (anything that comes in contact with the package temporarily or permanently)
Required Skills:
? Looking a mechanical semiconductor packaging engineer with knowledge of mobile phone manufacturing practices
? SMT process experience including; under-fill application, screen printing, stencil design, pick and place, PoP assembly techniques, SPI, rework, heat sink/spreader assembly, etc.
? Semiconductor package thermal and mechanical analysis or design through the use of analytical methods such as CFD and FEA.
? Knowledge of semiconductor package materials including solder alloys
? Knowledge of semiconductor package and assembly quality and reliability.
? Strong experience in problem solving and engineering debug is required
? Excellent verbal, written, and customer communications skills
? The ability to be self-motivated, take initiative, and to work equally well independently and in a team environment
? Ability to travel for up to 25% of time
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Job Title: Mobile FAE - Packaging Specialist
Degree Required:
Academic Discipline(s):
Experience Required:
Location: BSEE / BSME or equivalent foreign education
Engineering discipline
5-10years of experience developing SMT processes and establishing packaging specifications
Shenzhen, Shanghai, Beijing
Job Description:
As a Field Application Engineer – Packaging Specialist at Micron Technology, you will be in a customer facing engineering role representing Micron’s Packaging expertise. The initial role will be focused on mobile OEMs and may expand to cover other market segments in future. Your role is to be the primary contact with OEMs and ODMs that are working on integrating Micron’s products into their phones. You will be expected to establish a relationship with the packaging engineers and phone manufacturing engineers at the customers, discuss their requirements and work with them in understanding and tuning their SMT processes. You will also be interfacing with Micron assembly engineering, packaging R&D and Business Unit teams to feed customer packaging requirements into product development.
Responsibilities:
? Ensure smooth integration of Micron products into OEMs in the area of SMT and packaging, to secure Design Wins.
? Be the packaging technical advisor to customers on behalf of Micron to determine best practices
? Manage customer issues when they see failures related to packaging, be the technical debug expert in the field to advise customers and to work with internal FA teams.
? Provide technical engagement with other organizational partners to ensure customer approach, deliverables, and priorities are being met
? Influence both internal and external customers and partners on package development and integration to enable successful high-volume manufacture of Micron products
? Maintain knowledge in the areas of reliability and environmental systems, including Moisture, ESDs, Thermal, BLR, and Handling
? Maintain and develop knowledge of how systems are integrated, including SMT, insertion technologies, handling, heat sink attach, design, and materials (anything that comes in contact with the package temporarily or permanently)
Required Skills:
? Looking a mechanical semiconductor packaging engineer with knowledge of mobile phone manufacturing practices
? SMT process experience including; under-fill application, screen printing, stencil design, pick and place, PoP assembly techniques, SPI, rework, heat sink/spreader assembly, etc.
? Semiconductor package thermal and mechanical analysis or design through the use of analytical methods such as CFD and FEA.
? Knowledge of semiconductor package materials including solder alloys
? Knowledge of semiconductor package and assembly quality and reliability.
? Strong experience in problem solving and engineering debug is required
? Excellent verbal, written, and customer communications skills
? The ability to be self-motivated, take initiative, and to work equally well independently and in a team environment
? Ability to travel for up to 25% of time
职能类别： FAE 现场应用工程师
关键字： SMT packaging
公司介绍
美光科技全球化、多元化的发展致力于维护具备成本效益的精简化供应链，并广泛吸纳***人才参与美光最先进的内存技术发展。
美光西安工厂成立于2006年，主要开展集成电路装配与测试以及 DRAM 模块制造。该工厂对于美光在网络、云和数据中心等 DRAM 市场不断取得成功发挥重要作用。美光位于上海的研发中心专注从事的研发活动几乎涉及美光全部产品，从 DRAM 和 NAND 芯片设计，到托管型 NAND 系统产品设计和开发，再到 SSD 固件开发测试。美光还在中国设有三家客户实验室，通过与客户协作，帮助设计、优化并验证面向网络、计算、移动和嵌入式市场的内存系统。
美光西安工厂成立于2006年，主要开展集成电路装配与测试以及 DRAM 模块制造。该工厂对于美光在网络、云和数据中心等 DRAM 市场不断取得成功发挥重要作用。美光位于上海的研发中心专注从事的研发活动几乎涉及美光全部产品，从 DRAM 和 NAND 芯片设计，到托管型 NAND 系统产品设计和开发，再到 SSD 固件开发测试。美光还在中国设有三家客户实验室，通过与客户协作，帮助设计、优化并验证面向网络、计算、移动和嵌入式市场的内存系统。