Field Applictions Engineer-Mobile
美光半导体咨询（上海）有限责任公司
- 公司规模：500-1000人
- 公司性质：外资(欧美)
- 公司行业：电子技术/半导体/集成电路
职位信息
- 发布日期：2016-10-21
- 工作地点：北京-东城区
- 招聘人数：若干人
- 工作经验：8-9年经验
- 语言要求：英语 熟练
- 职位类别：FAE 现场应用工程师集成电路IC设计/应用工程师
职位描述
职位描述：
Job Title: Mobile Field Applications Engineer
Degree Required:
Academic Discipline(s):
Experience Required:
Location: BSEE or equivalent foreign education
Engineering discipline
Seven years of experience in Engineering discipline
Shenzhen, Beijing
Job Description:
Micron is hiring for multiple positions in Beijing and Shenzhen for Field Applications Engineers working with Mobile OEMs in China. Multiple positions are available with emphasis on either LPDDR or eMMC/UFS specialization. You will be part of a high impact FAE team that will be highly visible and will be driving deep technical engagements with customers in Advanced Memory products and their adoption in next generation mobile phones. This will be a customer facing engineering role focused on driving Design Wins, doing system level debug and solving customer technical issues. You will be expected to establish a relationship with the OEM Design & Engineering teams to drive revenue and market share along with Sales and Marketing teams.
Responsibilities:
? Drive Design Wins at Mobile OEMs
? Own the technical engagement with Mobile OEMs for all issues from design start, product qualification and mass production.
? Be the technical subject matter expert in the field for LPDDR or eMMC/UFS product, collaborating with other departments to ensure customer approach, deliverables, and priorities are being met
? Manage customer issues, perform in-lab debug and problem solving with the customer at their sites and/or at Micron labs.
? Maintain and develop knowledge of mobile system design, memory technology and integration of memory into mobile phones.
? Influence both internal and external customers and partners on customer technical requirements and selection of product specs and features.
? Identify and communicate and/or develop technical, customer focused application notes and other collateral (e.g., product guides, cross references, datasheets, system compatibility guides, etc.).
Required Skills:
Micron is looking for candidates that possess one or more of the skills below for the various positions available.
? Experience in LPDRAM bus interface debug, including initialization, training, timing and signal analysis techniques
? Understanding of LDRAM architecture
? Strong understanding of SI/PI design principles
? Demonstrate a strong understanding of techniques for managed NAND with experience performing system level debug
? Firmware development, testing and validation experience
? Integration and performance validation of memory and/or memory controllers
? Memory Controller design for either LPDDRx or eMMC/UFS
? Experience in mobile system performance measurement and power management techniques
? Hands-on debug experience in labs using mobile phone trace tools, logic analyzers, oscilloscopes, bus analyzers and evaluation boards.
? Strong experience in problem solving and engineering debug is required
? Excellent verbal, written, and customer communications skills
? The ability to be self-motivated, take initiative, and to work equally well independently and in a team environment
? Ability to travel for up to 25% of time
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Job Title: Mobile Field Applications Engineer
Degree Required:
Academic Discipline(s):
Experience Required:
Location: BSEE or equivalent foreign education
Engineering discipline
Seven years of experience in Engineering discipline
Shenzhen, Beijing
Job Description:
Micron is hiring for multiple positions in Beijing and Shenzhen for Field Applications Engineers working with Mobile OEMs in China. Multiple positions are available with emphasis on either LPDDR or eMMC/UFS specialization. You will be part of a high impact FAE team that will be highly visible and will be driving deep technical engagements with customers in Advanced Memory products and their adoption in next generation mobile phones. This will be a customer facing engineering role focused on driving Design Wins, doing system level debug and solving customer technical issues. You will be expected to establish a relationship with the OEM Design & Engineering teams to drive revenue and market share along with Sales and Marketing teams.
Responsibilities:
? Drive Design Wins at Mobile OEMs
? Own the technical engagement with Mobile OEMs for all issues from design start, product qualification and mass production.
? Be the technical subject matter expert in the field for LPDDR or eMMC/UFS product, collaborating with other departments to ensure customer approach, deliverables, and priorities are being met
? Manage customer issues, perform in-lab debug and problem solving with the customer at their sites and/or at Micron labs.
? Maintain and develop knowledge of mobile system design, memory technology and integration of memory into mobile phones.
? Influence both internal and external customers and partners on customer technical requirements and selection of product specs and features.
? Identify and communicate and/or develop technical, customer focused application notes and other collateral (e.g., product guides, cross references, datasheets, system compatibility guides, etc.).
Required Skills:
Micron is looking for candidates that possess one or more of the skills below for the various positions available.
? Experience in LPDRAM bus interface debug, including initialization, training, timing and signal analysis techniques
? Understanding of LDRAM architecture
? Strong understanding of SI/PI design principles
? Demonstrate a strong understanding of techniques for managed NAND with experience performing system level debug
? Firmware development, testing and validation experience
? Integration and performance validation of memory and/or memory controllers
? Memory Controller design for either LPDDRx or eMMC/UFS
? Experience in mobile system performance measurement and power management techniques
? Hands-on debug experience in labs using mobile phone trace tools, logic analyzers, oscilloscopes, bus analyzers and evaluation boards.
? Strong experience in problem solving and engineering debug is required
? Excellent verbal, written, and customer communications skills
? The ability to be self-motivated, take initiative, and to work equally well independently and in a team environment
? Ability to travel for up to 25% of time
职能类别： FAE 现场应用工程师 集成电路IC设计/应用工程师
关键字： LPDDR emmc eMCP
公司介绍
美光科技全球化、多元化的发展致力于维护具备成本效益的精简化供应链，并广泛吸纳***人才参与美光最先进的内存技术发展。
美光西安工厂成立于2006年，主要开展集成电路装配与测试以及 DRAM 模块制造。该工厂对于美光在网络、云和数据中心等 DRAM 市场不断取得成功发挥重要作用。美光位于上海的研发中心专注从事的研发活动几乎涉及美光全部产品，从 DRAM 和 NAND 芯片设计，到托管型 NAND 系统产品设计和开发，再到 SSD 固件开发测试。美光还在中国设有三家客户实验室，通过与客户协作，帮助设计、优化并验证面向网络、计算、移动和嵌入式市场的内存系统。
美光西安工厂成立于2006年，主要开展集成电路装配与测试以及 DRAM 模块制造。该工厂对于美光在网络、云和数据中心等 DRAM 市场不断取得成功发挥重要作用。美光位于上海的研发中心专注从事的研发活动几乎涉及美光全部产品，从 DRAM 和 NAND 芯片设计，到托管型 NAND 系统产品设计和开发，再到 SSD 固件开发测试。美光还在中国设有三家客户实验室，通过与客户协作，帮助设计、优化并验证面向网络、计算、移动和嵌入式市场的内存系统。