重庆招聘

Responsibilities and main tasks:
- Develop, design and qualification of new products, technologies, equipment, material, processes and production lines
- Define new product, process and equipment specifications
- Provide feasibility studies of new concepts and ideas
- Define and implement measurements to ensure product quality
- Liaison with external suppliers (equipment, material or chemical suppliers) and internal relevant departments for technological development and process improvement
- Take responsibility in new process qualification and new product implementation
- Ensure stable and robust process with full procedure compliance to manufacture high quality and reliable products
- Actively participate or drive project for new process qualification, new product implementation
- Continuously improve the process capability, quality, yield, productivity and resource optimization
- Train the new employees and transfer know-how to other engineers to relevant departments and other plant
- Document know-how and keep updating quality related details so as to handover the well-established processes for mass production


Required Qualifications and Skill Profile:
- Degree from university or higher technical college
- Knowledge of project management, data evaluation and design of experiments
- Knowledge of quality tools like SPC, MSA, DOE, FMEA, CP, etc
- Good analytical skills with attention to details.
- Good stress management skills
- Process engineering experience in IC-Substrate, HDI-PCB, Assembly, IC-Packaging or related industry
- Fluent written and oral English (Mandarin would be of advantage)
- Experience in working with intercultural teams preferred
- Willingness to travel and stay abroad for a certain time in one or our locations
- Open minded approach
- Good team working spirit and leadership skills
- Good communication and negotiation skills
- Computer skills - MS Office Package (Word, Excel)

We offer:
- Overseas training for selected candidates
- Career development possibilities in an international environment
- Be part on an international technical network
- Performance oriented salary and bonus
- Excellent working conditions

奥地利科技与系统技术股份公司（AT&S）简称奥特斯，是欧洲以及全球领先的高端半导体封装载板和高科技印制电路板制造商。集团致力于生产具有前瞻性技术的产品，并将工业领域的核心市场定位于：移动设备、汽车和航天、工业电子、医疗与健康以及先进封装领域。
    
作为一家迅速发展的跨国企业，奥特斯目前在奥地利本土和亚洲地区共拥有六个生产基地-奥地利：利奥本、菲岭；亚洲：印度南燕古德、韩国安山、中国上海、中国重庆。
    
奥特斯科技（重庆）有限公司建立于2011年，是奥特斯集团在中国设立的第二家独资企业（工厂位于江北区鱼嘴镇）。一厂生产全球领先的半导体封装载板，应用于电脑微处理器，是中国首家高端半导体封装载板制造商。二厂生产系统级封装印制电路板，产品应用于可穿戴设备和高端物联网产品。奥特斯2019年宣布在未来五年内投资近10亿欧元，计划在重庆现有的厂区内新建一座工厂（重庆三厂），生产应用于高性能计算模组的高端半导体封装载板，预计于2021年底投产，新增技术岗位300个左右。该投资主要基于数字化、人工智能、机器人以及自动驾驶蓬勃发展，以及市场对于高速数据处理能力的需求日益强劲，同时，也得益于奥特斯与全球领先的集成电路制造商的紧密合作。企业积极投资建设最先进的工厂，满足高性能计算模组不断增长的需求，同时促进创新人才的培养，为国家半导体产业的发展做出贡献。
   
欢迎广大有志人士加入奥特斯，携手共进，实现公司“不仅仅是奥特斯”的战略目标！

(特别说明：我司所有招聘工作按照RBA用工要求，充分尊重人权，人员招聘无宗教信仰/性别等歧视，不招聘童工。对未成年工不安排接触职业危害的岗位，不安排倒班。)