重庆招聘

Responsibilities and Main Tasks:
1. Integrate all project requirements of PF, R&D, and TT, and assist TD in resource integration.
2. Coordinate feasibility studies of new projects/programs.
3. Ensure appropriate resources are available and assign necessary support to all associated projects/programs.
4. Coordinate readiness review and project handover between the PF team, R&D, TT and TD.
5. Coordinating and prioritizing of resources across departments in order to achieve new product build.
6. Lead and chair PF/R&D/TT project Integration Meeting as well as defined regular project readiness audits with identified team members.
7. Perform other tasks as assigned by superior.
Requirement：
1. Degree from university or higher technical college, mechanical/ electrical/ automation/ Information Engineering.
2. Experience in process design and advanced product qualification procedure background
3. Experienced in managing cross department project teams
4. Proven ability to communicate with people at all department, ranging from R&D, PF, TT to TDI
5. Strong interpersonal and collaborative skills, as well as strong skills as a negotiator to reach consensus, buy-in and commitment
6. Deep understanding of IC-Substrate, HDI-PCB, Assembly, IC-Packaging technology enablement and current technology tools
7. Experience in integration with product and process preferred
8. Knowledge of project management, data evaluation and design of experiments
9. Background in equipment integration into MES
10. Knowledge of quality tools like SPC, MSA, DOE, FMEA, CP, etc.
11. Good analytical skills with attention to details.
12. Good stress management skills
13. Well organized and independent
14. Fluent written and oral English necessary and Chinese
15. Good team player and leadership skills with ability to coach and train others.
16. Good communication and negotiation skills
17. Computer skills – MS Office Package (Word, Excel)
18. Willingness to support assignment task beyond working hour.
19. Proactive in approaching superior or related reporting line for guidance and outcome alignment.
20. Provide technical know-how guidance & documentation preparation guideline to team members.

奥地利科技与系统技术股份公司（AT&S）简称奥特斯，是欧洲以及全球领先的高端半导体封装载板和高科技印制电路板制造商。集团致力于生产具有前瞻性技术的产品，并将工业领域的核心市场定位于：移动设备、汽车和航天、工业电子、医疗与健康以及先进封装领域。
    
作为一家迅速发展的跨国企业，奥特斯目前在奥地利本土和亚洲地区共拥有六个生产基地-奥地利：利奥本、菲岭；亚洲：印度南燕古德、韩国安山、中国上海、中国重庆。
    
奥特斯科技（重庆）有限公司建立于2011年，是奥特斯集团在中国设立的第二家独资企业（工厂位于江北区鱼嘴镇）。一厂生产全球领先的半导体封装载板，应用于电脑微处理器，是中国首家高端半导体封装载板制造商。二厂生产系统级封装印制电路板，产品应用于可穿戴设备和高端物联网产品。奥特斯2019年宣布在未来五年内投资近10亿欧元，计划在重庆现有的厂区内新建一座工厂（重庆三厂），生产应用于高性能计算模组的高端半导体封装载板，预计于2021年底投产，新增技术岗位300个左右。该投资主要基于数字化、人工智能、机器人以及自动驾驶蓬勃发展，以及市场对于高速数据处理能力的需求日益强劲，同时，也得益于奥特斯与全球领先的集成电路制造商的紧密合作。企业积极投资建设最先进的工厂，满足高性能计算模组不断增长的需求，同时促进创新人才的培养，为国家半导体产业的发展做出贡献。
   
欢迎广大有志人士加入奥特斯，携手共进，实现公司“不仅仅是奥特斯”的战略目标！

(特别说明：我司所有招聘工作按照RBA用工要求，充分尊重人权，人员招聘无宗教信仰/性别等歧视，不招聘童工。对未成年工不安排接触职业危害的岗位，不安排倒班。)