重庆招聘

职责描述：
1、Own the plant level yield improvement activities by the assignment from Superior or upon the observation of defect trend data.
2、Drive the yield improvement across different area of the plant with direct coordination with department managers and staff
3、Keep superior informed about the possible threats and/or opportunities
4、Develop and equip full process knowledge and technical skill including data analysis and database application
5、Lead data analysis and activities to identify the possible root cause. Validate and implement solution for containment and permanent improvement to the issue
6、Form and lead a WG/TF team from the related resources and assign/delegate task to appropriate team member for fast and effective action.
7、Engage all the team members to resolve the issue for success. Bring up the team member’s capability through guidiance and training if required in related task.
8、Breakthrough a chronic issue or excursion. Bring up the related yield performance. Define and implement actions and system to sustain the performance.
9、Apply problem solving methodology (eg MBPS, statistical analysis, etc) to solving technical issue
10、Negotiate technical solutions within cross function and manage the conflict and balance the opposing demands.
11、Secure any action of change for improvement is fully covered by thorough risk assessment. 12、Alignment and approved from different parties are documented before full implementation.
13、Effectiveness of improvement is validated and monitored. Other drawback induced by the improvement is also a focus and need to avoid.
14、Strong quality mindset and customer orientation
15、Regular update the improvement activities status to management
16、Communicate directly to customer to resolve any technical and performance concern
17、Share and promote the technical know-how to related department/CIP/YIP/NPI upon the learning from the resolved issue

任职要求：
1、Degree from university or above.
2、Process engineering experience in IC-Substrate, HDI-PCB, Assembly, IC-Packaging or related industry.
3、Strong ownership for project and improvement.Extreme motivated.
4、Mastering of project management, data evaluation, database application and design of experiments.
5、Excellent analytical skills with attention to details. Good stress management skills
6、Knowledge of quality tools like SPC, MSA, DOE, FMEA, CP, etcGood communication and negotiation skills.
7、Fluent written and oral English (Mandarin would be of advantage).Computer skills – MS Office Package (Word, Excel).

奥地利科技与系统技术股份公司（AT&S）简称奥特斯，是欧洲以及全球领先的高端半导体封装载板和高科技印制电路板制造商。集团致力于生产具有前瞻性技术的产品，并将工业领域的核心市场定位于：移动设备、汽车和航天、工业电子、医疗与健康以及先进封装领域。
    
作为一家迅速发展的跨国企业，奥特斯目前在奥地利本土和亚洲地区共拥有六个生产基地-奥地利：利奥本、菲岭；亚洲：印度南燕古德、韩国安山、中国上海、中国重庆。
    
奥特斯科技（重庆）有限公司建立于2011年，是奥特斯集团在中国设立的第二家独资企业（工厂位于江北区鱼嘴镇）。一厂生产全球领先的半导体封装载板，应用于电脑微处理器，是中国首家高端半导体封装载板制造商。二厂生产系统级封装印制电路板，产品应用于可穿戴设备和高端物联网产品。奥特斯2019年宣布在未来五年内投资近10亿欧元，计划在重庆现有的厂区内新建一座工厂（重庆三厂），生产应用于高性能计算模组的高端半导体封装载板，预计于2021年底投产，新增技术岗位300个左右。该投资主要基于数字化、人工智能、机器人以及自动驾驶蓬勃发展，以及市场对于高速数据处理能力的需求日益强劲，同时，也得益于奥特斯与全球领先的集成电路制造商的紧密合作。企业积极投资建设最先进的工厂，满足高性能计算模组不断增长的需求，同时促进创新人才的培养，为国家半导体产业的发展做出贡献。
   
欢迎广大有志人士加入奥特斯，携手共进，实现公司“不仅仅是奥特斯”的战略目标！

(特别说明：我司所有招聘工作按照RBA用工要求，充分尊重人权，人员招聘无宗教信仰/性别等歧视，不招聘童工。对未成年工不安排接触职业危害的岗位，不安排倒班。)