重庆招聘

Responsibilities:

1. Under general supervision of development manager for assembly process development tasks, include technical survey, process capability analysis, risk assessment, experiment design and execution.

2. Follow up with relevant functional teams to get timely support and task update to meet factory/department development goal.

3. Ensure the readiness to support the next generation manufacturing technology requirements.

4. Collaborate with global packaging engineering team to understand the product roadmaps, timelines, and next generation product packaging technology requirements. Also, to understand the manufacturing technology needs and assess the gaps in the factory prototype and production capability

5. Work closely with global packaging engineering and Fab technology team to design manufacture technology test vehicles as needed ahead of first BJ prototype builds.

6. Collaborate on advanced design rules, characterize the capability improvement needs and define the gaps both in the process and equipment.

7. Define plans, schedules, and actions ahead of first prototype builds to develop or improve prototype / HVM capability.

Requirements:

* Bachelor or above on Engineering or experience equivalent to that

* 3-6 years of semiconductor assembly experience.

* Hands on process experience on stealth dicing, wafer back grinding, dicing, die preparation,ultra-thin wafer handling and other advanced DPS technology.

* Excellent communication skill and working skill, high level creative thinking.

Laser Saw （芯片切割）

上海威峰电子科技有限公司是港商独资企业，集团下属有：成都威峰电子有限公司、苏州行政办事处、上海业务承接及销售办公室。
上海分公司位于松江出口加工区。公司下属公司通过了ISO—9001:2000质量管理体系认证、QS9000质量管理体系认证和16949质量管理体系认证以及ISO14000环境管理体系认证。
公司生产多种型号PCB及封装测试产品。同时涉及半导体行业专业人员培训、管理及市场信息统计。产品远销欧美、东南亚及中国港澳地区。