重庆招聘

职位描述：
主要工作职责
1. Plan and develop new opportunities with AOS US Assembly RD， China MKT & TW PIC department。
2. Drive the reliable feasibility evaluation of new product, design with best performance/cost ratio, robust process development and qualification with solid data for new product.
3. Plan the budget for package R&D and Assembly process engineering improvement/study.
4. Organize the key performance index and goal for assembly engineering team.
5. Drive the new qualification sample preparation, and the new process, new technology, materials, equipment study & implement for assembly line and wafer plating line.
6. Build-up the linkages and working relationships with internal technology partners to share and leverage knowledge and processes.
7. Drive the Assembly subcontract business engineering issues, qualify the new subcontract, work with subcontract to qualify and release the new parts to support the business plan, .
8. Plan and organize the training course for assembly engineering team members, and coach assembly engineering managers to drive the engineering and production line capability enhancement, -- CIP, DOE, QCC, PFMEA/DFMEA review, 8D/Engineering case study reporting skill, regular review meeting.
9. Drive the trouble shooting, yield improvement, efficiency improvement, UPH improvement, cost-down project, QC criteria review and modify, Working instruction create & review, optimize the production flow, modify the equipments & tooling design.
10. Drive the new material, equipment and tools vendors’ certification and quality control.

岗位要求
a) Education 教育:
At least First level university degree, Advanced degree preferred, major in Physical Chemistry, Mechanical structure/design, Material Science Master degree is preferred.

b) Experience经验:
15+ years experience in semiconductor assembly R&D project/Process engineering team management or in like roles/businesses.

c) Competency and Skills能力和技能:

1. Experience with Assembly FOL or EOL package assembly Process is necessary;
2. Excellent knowledge on material analysis, package assembly process, package assembly equipment, package qualification method, project management
3. Demonstrates an in-depth knowledge of key AOS operational policies, processes and methodologies applicable to project management.
4. Strong Communication skill, team work spirit and leadership
5. Decision-making
6. Quality Focus
7. Proficient in spoken and written English

d) Trainings上岗所需培训:
       Plating principle
       General material analysis, structure analysis, failure analysis knowledge
Knowledge of Semiconductor and Advance Package
AOS Quality system
Effective team building to unleash the potential of people
Cross-function training of BGBM, testing / fab process flow, device technology 举报 分享

Alpha and Omega Semiconductor, Inc.（简称“AOS公司”）成立于2000年，总部位于美国硅谷，是一家集半导体设计、晶圆制造、封装测试为一体的企业，主要从事功率半导体器件（含功率MOSFET、IGBT和功率集成电路产品）的产品设计和生产制造。目前AOS公司在美国俄勒冈有一座8英寸晶圆厂、在上海松江有二座封装工厂，在美国硅谷、台湾、上海均设有研发中心。产品市场涉及笔记本电脑、液晶电视、手机、家电、通讯设备、工业控制、照明应用、汽车电子等领域。

重庆万国半导体科技有限公司是由AOS公司与渝富集团、两江新区战略性新兴产业股权投资基金合资经营。于2016年3月落户重庆两江新区水土工业开发区，项目总投资10亿美元，占地340亩。将分两期建设12英寸功率半导体芯片制造及封装测试生产基地。具备芯片设计、晶圆制造、封装测试全产业链能力。产品不仅将销往国内外，还将广泛应用于本地优势企业，对重庆市发展汽车、智能终端、轨道交通产业都具有积极推动作用，市场空间巨大。

重庆万国半导体科技有限公司为员工提供：
舒适的工作环境；
多样化培训；
丰富多彩的业余活动；
具有竞争力的薪酬福利政策；
年假政策；
商业保险计划等。

重庆万国半导体科技有限公司现诚邀热衷半导体事业，勇于奉献、创新的各界人才加盟！您将与半导体业界的精英一起努力，开创重庆半导体行业的新篇章！