成都招聘

Duties and Responsibilities
1. Responsible for PKG NPI Process Set-up (including cost reduction, new material development and new process development) in the area of Solder die attach (soft solder die attach, paste solder die attach, epoxy die attach), Reflow soldering and cleaning, Heavy Al wire bond (5-20 mils wire) , Au wire bond and Cu wire bond.
2. Responsible for process characterization and improve process capability based on 6sigma process capability.
3. Responsible for co-work and hands over to process engineering on process set-up results according to APQP procedure based 6sigma process capability.
4. Responsible new process equipment selection and evaluation to communicate with equipment engineering with right comparison of COO
5. Benchmarking one new process and new Process Development that does not exist and outside design Rule by Co-work with Dev. Engineer and process engineers
6. Conduct PA work following Advanced Product Qualification Plan (APQP) Spec, FSC-QAR-0013.
7. Responsible for deliberative package development, Major Tool Change (Mold die etc) to improve quality and In-sourcing project that is new
8. Holding technical leadership for process development working with project members such like Industrial Engineering, SCM, Purchasing, Process Engineering, QA, Program management, Human resource, Facility, and manufacturing.
9. Study and understand customer requirements, application, EHS and design those things to the process development.
10. Supporting development engineers to generate and create documents deliverables such as control plan, process FMEA, LAR（ALR）-assembly level reliability 封装级的可靠性要求， plan, project charter, Quality function development, project schedule, line certification plan, to identify process development cost, etc.
11. To plan and execute process optimization, failure analysis, process characterization, samples build for the development.
12. To lead project team members related with process development.
13. To find technical and systematic solution for failures of reliability, quality, manufacturability, cost, and cycle time that are related with process.
14. Track team member performance and report to origination manager
15. To share and update project progress, risk of delay, constraints, weekly at
designated day with stakeholders, project team, sponsors.


Qualifications
Experienced years : Longer than 15 years preferred in wire bond process with longer than 10 years preferred in die attach process
Experienced areas : Solder die attach (soft solder die attach, paste solder die attach, epoxy die attach), Reflow soldering and cleaning, Heavy Al wire bond (5-20 mils wire) , Au wire bond, Cu wire bond
Experienced jobs : Leadframe design guideline, Understanding of materials (Leadframe, Solder, Flux, DBC, Wire), Understanding of relation between manufacturability and reliability by POR (Process of record) and BOM (Bill of material), Equipment set-up/maintenance, process/equipment/material troubleshooting and control, purchase spec/selection guideline and qualification for equipment and material
Experienced packages : Power discrete (like TO220, D-Pak, QFN) and Power module packages (like SPM, IPM, IGBT/Diode module)
Nationality : Local Chinese is preferred
Education: 4yrs college or university preferred .
Skills: Communication skills, Fluent with written English and speaking. Min level 4 and recommended 6.
Other characteristics such as personal characteristics : Self motivated, independent, open mind to communicate, be willing to take risk

上海威峰电子科技有限公司是港商独资企业，集团下属有：成都威峰电子有限公司、苏州行政办事处、上海业务承接及销售办公室。
上海分公司位于松江出口加工区。公司下属公司通过了ISO—9001:2000质量管理体系认证、QS9000质量管理体系认证和16949质量管理体系认证以及ISO14000环境管理体系认证。
公司生产多种型号PCB及封装测试产品。同时涉及半导体行业专业人员培训、管理及市场信息统计。产品远销欧美、东南亚及中国港澳地区。