Hardware Team Manager 硬件开发经理(成都)
科胜讯数字电视（成都）有限公司
- 公司规模：50-150人
- 公司性质：外资(欧美)
- 公司行业：电子技术/半导体/集成电路
职位信息
- 发布日期：2014-02-21
- 工作地点：成都-高新区
- 招聘人数：1
- 工作经验：八年以上
- 学历要求：本科
- 语言要求：英语熟练
- 职位类别：项目经理 信息技术经理/主管
职位描述
工作地点： 成都
向总监汇报
要求：8年专业技术经验，5年团队和项目管理经验，英文流利，能满足与海外技术部门日常沟通和协调的需要
Responsibilities
?Managing a 10-people scale of experienced hardware team, reporting to system engineering director.
?Working with operation engineering team for board design planning according to company’s product milestone, to support new-generation IC’s validation, customer evaluation and reference solution development, covering embedded/PC audio, video security/monitoring and fax/modem product lines.
?Leading resource to work with marketing, software and customer contact windows on customized designs’ requirement specifying, board development and bringup supporting.
?Managing projects and driving engineers on the basis of internal design procedures to release qualified hardware designs with meeting requirements.
?Leading resource to supporting FAE team and customers on technical issue (in production) investigation and resolving.
?Leading resource to undertake new-generation audio IC’s FPGA verification work, including FPGA platform architecting, module board HW design, RTL code porting/synthesis, and verification planning/testing/debugging.
?Supporting VLSI design and product engineering team on Chip’s pin-out, substrate and package analysis or proposal from real application’s perspective.
?Leading resource to provide HW support to local IC validation team, Software/Driver team and SW test team.
Qualifications
?8+ years of HW and system design/engineering experience, plus 5+ years of team management and project management experience.
?Strong initiative on continuous project/team management improvement.
?Strong knowledge on generic hardware design and testing including audio codec, baseband video, power, display, sensor, SoC/DDR/Flash based multimedia system, DSP, FPGA as well as component technologies.
?Familiar with system level performance evaluation and validation.
?Good experience in design refining and cost optimization.
?Good experience on Cadence and Mentor’s EDA tools. Good knowledge on SI and PI is preferred.
?Experiences in mechanical, thermal and EMC design is a plus.
?Excellent communication, documentation and presentation skills.
?Fluent spoken English and good experience in cooperation with oversea design center.
?BS Degree in EE or relevant is a must, MS is preferred.
向总监汇报
要求：8年专业技术经验，5年团队和项目管理经验，英文流利，能满足与海外技术部门日常沟通和协调的需要
Responsibilities
?Managing a 10-people scale of experienced hardware team, reporting to system engineering director.
?Working with operation engineering team for board design planning according to company’s product milestone, to support new-generation IC’s validation, customer evaluation and reference solution development, covering embedded/PC audio, video security/monitoring and fax/modem product lines.
?Leading resource to work with marketing, software and customer contact windows on customized designs’ requirement specifying, board development and bringup supporting.
?Managing projects and driving engineers on the basis of internal design procedures to release qualified hardware designs with meeting requirements.
?Leading resource to supporting FAE team and customers on technical issue (in production) investigation and resolving.
?Leading resource to undertake new-generation audio IC’s FPGA verification work, including FPGA platform architecting, module board HW design, RTL code porting/synthesis, and verification planning/testing/debugging.
?Supporting VLSI design and product engineering team on Chip’s pin-out, substrate and package analysis or proposal from real application’s perspective.
?Leading resource to provide HW support to local IC validation team, Software/Driver team and SW test team.
Qualifications
?8+ years of HW and system design/engineering experience, plus 5+ years of team management and project management experience.
?Strong initiative on continuous project/team management improvement.
?Strong knowledge on generic hardware design and testing including audio codec, baseband video, power, display, sensor, SoC/DDR/Flash based multimedia system, DSP, FPGA as well as component technologies.
?Familiar with system level performance evaluation and validation.
?Good experience in design refining and cost optimization.
?Good experience on Cadence and Mentor’s EDA tools. Good knowledge on SI and PI is preferred.
?Experiences in mechanical, thermal and EMC design is a plus.
?Excellent communication, documentation and presentation skills.
?Fluent spoken English and good experience in cooperation with oversea design center.
?BS Degree in EE or relevant is a must, MS is preferred.
公司介绍
美国科胜讯国际有限公司是全球著名无工厂IC设计公司之一，在宽带通讯、企业网和数字家庭领域的芯片技术处于世界领导地位，在业界超过20年的历史，有超过300名员工遍布全球。科胜讯数字电视（成都）有限公司是美国科胜讯国际有限公司在成都高新区投资建立的独资企业，是科胜讯国际有限公司在中国地区的研发中心。2014年10月14日在美国加州获得由OC Tech联盟颁发的第21届高科技年度杰出创新大奖（智能语音）Website: www.conexant.com
A privately held fabless semiconductor company located in Irvine, California, Conexant has offices and design centers worldwide, 300+ employees and a strong patent portfolio. Our rich history spans over 20 years. We are recognized for our innovations in audio and imaging technology that have fueled many industry firsts.
总部：美国Irvine, CA
中国上海，北京，成都
印度
日本
韩国
中国台湾
新加坡
公司大事记：
October 28, 2014 | Conexant Receives 2014 Speech Technology Excellence Award
October 14, 2014 | Conexant Receives the Outstanding Semiconductor Award for OC Tech Alliance’s 21st Annual High-Tech Innovation Awards
September 23, 2014 | Conexant Spotlights AudioSmart Solutions at Intel Innovation Week
July 24, 2014 | Conexant Named a Finalist for 21st OC Tech Alliance High-Tech Awards for the Semiconductor Category
June 3, 2014 | Conexant Launches New HD Audio CODEC with Integrated AudioSmart Class-D Amplifier
May 29, 2014 | Conexant Debuts AudioSmart Software for PCs, Tablets
May 6, 2014 | Conexant to Bring Nuance Voice-Enabled, Wake-Up Capability to Everything from Smart TVs to Home Appliances – and More
January 7, 2014 | Conexant Taps Broadcom’s WiFi to Deliver World-Class Networked Imaging Solution
January 7, 2014 | Conexant’s New Voice Input Processor for Smart TVs Provides Smarter Audio Experience
January 7, 2014 | Energy-Efficient, VoIP-Enhanced Fax Modem Chips from Conexant Make Multi-Function Printers Smarter
January 7, 2014 | AudioSmart Solutions from Conexant to Target Far-Field Voice Processing for TVs, PCs, Smart Phones and Tablets
January 7, 2014 | Conexant SoC Enables World’s Smallest Pocket Photo Smart Mobile Printer
A privately held fabless semiconductor company located in Irvine, California, Conexant has offices and design centers worldwide, 300+ employees and a strong patent portfolio. Our rich history spans over 20 years. We are recognized for our innovations in audio and imaging technology that have fueled many industry firsts.
总部：美国Irvine, CA
中国上海，北京，成都
印度
日本
韩国
中国台湾
新加坡
公司大事记：
October 28, 2014 | Conexant Receives 2014 Speech Technology Excellence Award
October 14, 2014 | Conexant Receives the Outstanding Semiconductor Award for OC Tech Alliance’s 21st Annual High-Tech Innovation Awards
September 23, 2014 | Conexant Spotlights AudioSmart Solutions at Intel Innovation Week
July 24, 2014 | Conexant Named a Finalist for 21st OC Tech Alliance High-Tech Awards for the Semiconductor Category
June 3, 2014 | Conexant Launches New HD Audio CODEC with Integrated AudioSmart Class-D Amplifier
May 29, 2014 | Conexant Debuts AudioSmart Software for PCs, Tablets
May 6, 2014 | Conexant to Bring Nuance Voice-Enabled, Wake-Up Capability to Everything from Smart TVs to Home Appliances – and More
January 7, 2014 | Conexant Taps Broadcom’s WiFi to Deliver World-Class Networked Imaging Solution
January 7, 2014 | Conexant’s New Voice Input Processor for Smart TVs Provides Smarter Audio Experience
January 7, 2014 | Energy-Efficient, VoIP-Enhanced Fax Modem Chips from Conexant Make Multi-Function Printers Smarter
January 7, 2014 | AudioSmart Solutions from Conexant to Target Far-Field Voice Processing for TVs, PCs, Smart Phones and Tablets
January 7, 2014 | Conexant SoC Enables World’s Smallest Pocket Photo Smart Mobile Printer
联系方式
- Email：wendy.gu@conexant.com
- 公司地址：上班地址：成都高新区