成都招聘

As a part of Intel Chengdu failure analysis (FA) team, you will actively engage in FA support in Central Processing Unit (CPU), Platform Controller Hub (PCH) and silicon wafer/die and improving product yield, quality and/or reliability. This job will not only bring you to learn the world’s advanced semiconductor technology and product, but also offer your unique opportunity to look into the magic of microscopic world of the component through world-class advanced tools and methodologies. You have chance to grow yourself to be a master in failure isolation (FI) methodology and techniques, material analysis and characterization, metallurgy, thermal/mechanical and data analysis. You will not only determine the root cause of failure and failure mechanism, but also collaborate with various functional groups to resolve technical challenges and drive robust root cause fix through innovative solutions. You will be responsible for defining FAFI process and developing new FA methods/process to ensure new product/technology smooth transfer and startup. With this job, your logic thinking and soft skills (e.g. project management, communication/presentation skills) will go up to next level through your day to day work. Intel FA labs globally are available to you and you can work together with word class talents to resolve challenging technical issues.

Qualifications:

• Bachelor degree or above in Electronics or electrical engineering, Material Science, Physics, Mechanical and Chemicals engineering.
• Proficient oral and written English.
• Be able to deep dive into technical challenges, clear logic thinking and good at problem solving.
• Self-motivated, good communication skills and team spirit.
• Knowledge in data analysis, machine learning and artificial intelligence is a plus.

英特尔成都封装测试厂是英特尔全球三大晶圆预处理工厂之一，2003年宣布建厂，三次增资，截至到2014年11月总投资额达到6亿美元。“成都芯片组业务”使用英特尔最先进的封装技术来组装芯片组；“成都微处理器业务”为世界各地的计算机生产微处理器。2014年12月，英特尔宣布将在未来15年投入16亿美元引入最新“高端测试技术”并全面升级成都工厂。成都封装测试厂已成为英特尔全球重要的生产引擎和移动设备新产品首发试制基地，也是英特尔响应中国政府“西部大开发”政策的重要战略举措。

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