FEA Simulation Engineer
芯源系统有限公司
- 公司性质:外资(欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2021-01-14
- 工作地点:成都
- 招聘人数:3人
- 工作经验:本科
- 学历要求:招3人
- 语言要求:不限
- 职位类别:半导体技术
职位描述
岗位职责:
- Mechanical or thermal stress analysis on package level & board level;
- package & board level heat dissipation simulation ;
- Parametric analysis on ranking key impact factors for improved product reliability;
- provide improvement solution for IC packaging related fracture ,fatigue, warpage, interface delamination issues through FEA simulation at both early failure and long term failure stage ;
- classify stress related failure and accordingly the failure mechanisms;
- optimize device & package structure or design to mitigate cracking related failure from stress ,warpage ,material , and manufacturing perspective ;
岗位要求:
· MS degree in Mechanical Engineering , Engineering Mechanics, Materials, Physics , or solid training in mechanics ; PhD is a plus ; +2 years FEA working experience with BS degree ;
· Strong knowledge and experience on thermal-mechanical modeling, fatigue failure modeling, and heat dissipation simulation ;
· Hands-on experience of major FEA tools (e.g.,ANSYS, ABAQUS,Hypermesh, ,etc),heat dissipation simulation tools(e.g., Icepak,Flotherm,etc. ) and modeling tools (e.g., Solidworks,ProE,etc);
· Deep understanding of packaging materials (including soldering materials ) and their mechanical behaviors ;
· Good at statistical data analysis ;
· Knowledge of electronic packaging structure and process ,as well as its reliability;
Package qualification requirements is a plus;
· Good team player , and able to perform independent research & development work;
· Good written and verbal communication skills ;
职能类别:半导体技术
公司介绍
MPS 2022校园招聘现如约而至,诚邀勇于创新、敢于挑战的你!加入MPS,与芯同行,引领未来!
公司福利
·全球知名模拟IC芯片研发公司
·公司文化:工程师文化,技术导向,关注员工成长,提倡工作、家庭和生活平衡
·薪资体系:行业领先薪资 + 股权激励 + 六险一金 + 20天超长年假 + 年度旅游 + 年度体检 + 节假日其他福利
联系方式
- Email:hr-cn@monolithicpower.com
- 公司地址:成都市高新西区综合保税区科新路8号 (邮编:611731)