成都招聘

• Test Thermal Mechanical Expert is responsible for solving technical issues in test manufacturing process. The technical challenge includes but not limited to complex thermal control,  precise force application and mixing with fluctuated device power during test.
• This job requires a full understanding of semiconductor assembly/test process in semiconductor factory,  and high-paced solution development for various issues like thermal run-away, mechanical over/under stress, cosmetic defect etc. from generation by generation of Intel product and equipment. Technical leadership and collaboration capability is throughout the routine work to lead or cooperate team across assembly and test engineering and high volume manufacturing for technology issue solving.
• The job scope is not only on technical area but also expanded to process optimization, spec definition, project management, equipment qualification, HVM supporting etc.  Comprehensive ability is required to handle the issues compounded with technical, process and business factors.

Basic Qualifications:

• BS/MS in EE or ME related degree.
• 10+ years Assembly & Test manufacturing experience on mechanical design, thermal control, electronical testing or related.
• Experience on leading great technology development and resulting in successful implementation in manufacturing.
• Solid understanding on DOE principles, MBPS, 5 WHY, FMEA
• Data expert on commonality analysis, parametric data calculation, thermal profile plotting by tools excel, jmp etc.
• Excellent project management skills.
• Excellent written & verbal communication skill.

Preferred Qualifications:

• Thermal control experience
• Experience in mechanical design and manufacturing.
• Scripting skill on Pathon, SQL, VBA etc

英特尔成都封装测试厂是英特尔全球三大晶圆预处理工厂之一，2003年宣布建厂，三次增资，截至到2014年11月总投资额达到6亿美元。“成都芯片组业务”使用英特尔最先进的封装技术来组装芯片组；“成都微处理器业务”为世界各地的计算机生产微处理器。2014年12月，英特尔宣布将在未来15年投入16亿美元引入最新“高端测试技术”并全面升级成都工厂。成都封装测试厂已成为英特尔全球重要的生产引擎和移动设备新产品首发试制基地，也是英特尔响应中国政府“西部大开发”政策的重要战略举措。

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