成都招聘

Job Summary:
-Serve as customer advocate on product quality related issues.
-Quality planning and quality engineering activity in new product introduction and engineering change and qualification.
-Effective problem solving via defect analysis, problem containment, root-cause analysis and corrective actions.
-Internal focal point for handling customer complaints.
-Develop Process Control Plan
-Liaise with Customer on Engineering Change Approval

Principal Accountabilities:
-Perform quality planning and quality deployment function on new product, engineering changes and capacity expansion.
-Liaise and work with customer to fulfill their product, quality and reliability requirements.
-Establish and implement the non-conforming product containment plans and problem elimination.
-Perform system and process audits to detect potential process and product quality problem.
-Coordinate and follow-up on the effectiveness of the corrective actions with responsible personnel on quality related issues.
-Communicate proactively with customer on our quality improvement efforts and engineering changes.

Qualifications and Experience:
-Bachelor or diplomate degree in Electrical, Mechanical, Industrial Engineering, Physics, chemistry or Materials Science.
-Good working knowledge on semiconductor field is a plus.
-Good working knowledge in reading, writing and oral English.
-Good understanding of QFD, DFMEA / PFMEA, Control Plan, MSA, Statistical Process Control and basic Problem Solving Skills (Global 8D methodology) is a plus.
-Good working knowledge in ISO 9001, QS-9000, ISO / TS 16949 and JEDEC standards is a plus.
-Working knowledge in 7 QC tools / Six Sigma / Kaizen tools is a plus.
-Working knowledge in materials, defect analysis and reliability testing is a plus.
-Working knowledge in computer and software programming is a plus.
-Possess good communication and interpersonal skills
-Good analytical skills.
-Possess Kaizen mindset.
-Good listening skills.
-Good planning skills.
-Good presentation skills
-Able to make decision with respect to final product acceptance, non-conformance product rejection and product disposition.
-Integrity and honest
-Team player

    UNISEM CHENGDU CO., LTD. 宇芯（成都）集成电路封装测试有限公司
    Unisem 集团成立于1989年，总部位于马来西亚首都吉隆坡，自1992年开始从事独立的IC封装和测试，目前可为客户提供Wafer Bumping、晶圆测试、IC封装与测试及相关辅助服务，拥有世界领先的半导体封装测试技术；现为马来西亚领先的芯片制造商，在马来西亚怡保、英国威尔士、中国成都、印尼巴淡、美国加州等地拥有生产制造工厂，员工总数达到8500人左右。
    2004年8月，UNISEM宣布将投资2.1亿美金在成都高新西区出口加工区西区新建其旗下现代化程度的半导体工厂，使其成为UNISEM在全球的旗舰企业---宇芯（成都）集成电路封装测试有限公司。宇芯(成都）将采用目前世界上最先进的、全新的设备和工艺生产BGA、SLP、TSSOP、SOIC等高端产品。宇芯（成都）现拥有一期工厂和二期工厂，三期工程即将开建，员工总数将达到4500-5600人。
     宇芯（成都）以团队精神、信赖、责任、主动、关爱为核心价值，并倾注极大的关注在员工福利、健康与安全上。我们把员工视为企业最有价值的资产，并为员工提供良好的培训，包括海外培训及广阔的发展空间。
     诚邀您加入宇芯大家庭，让我们与宇芯（成都）一同成长、共创辉煌、共享成功！
     公司提供优厚的薪资待遇：工资+补贴+年底十三薪+浮动奖金+年度调薪+入职即购五险一金+商业保险+结婚/生子/生日礼金+节假日礼品+带薪年假12天/年
     公司有员工食堂，提供住宿（6人间，带空调，独立卫浴，24h热水供应）
   
地 址：成都市高新区出口加工区西区科新路8号附2号
联 系 人：Human Resource
电子邮箱：oliveliu@unisemgroup.com
联系电话：028-68906288-1009