成都招聘

Package Design Engineer


Description
Job Description: NSG Package Design Engineer is responsible for world-class cost product substrate design to deliver a compelling advantage with NVM product solutions and test vehicle substrate design for packaging technology development. He/she should provide overall package designs including products, test vehicles, T/M/E performance, design rule etc. to enable NSG product and packaging technologies.



Qualifications
Candidate should possess a Master 's degree or a Bachelor's degree in Electrical Engineering or Mechanical Engineering. Additional qualifications include:
- 2 years experience in package design or related
- Understanding of physical design, reliability, thermal, electrical, and mechanical aspects of packaging, assembly process and/or manufacturing and cost
- Good communication skills and team work
- Experience with package and Printed Circuit Boards (PCB) design/layout, familiar with tools Cadence design tools (APD, Allegro PCB), knowledge/experience with others such as Mentor is preferred

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