北京招聘

职位描述：
Please provide English resume.
职位描述：
1.Responsible for Assembly & Packaging NPI at AMD Suzhou.
2.Lead new product Packaging/Assembly development and qualification at AMD Suzhou.
3.Drive and work with Assembly process team for yield improvement during NPI stage.
4.Participate in problem solving of Assembly & packaging related Failure Analysis.
5.Familiar with the quality and reliability test conditions and specifications.
6.Interface with materials suppliers (substrate, underfill, etc) for engineering and quality related issues.
7.Team lead responsible to guide junior engineers (optional).
8.Participate in MRB to review quality excursion and provide lot disposition.

岗位要求：
1.Education: Bachelor degree in mechanical or materials Engineering or equivalent.
2.Language: Excellent oral and written skills in English and Mandarin
3.Experience: 5-8 years’ industrial experience with 3-5 years’ in flip chip packaging & assembly development
4.Project Management
5.Good understanding of Semiconductor processes.
6.Strong problem solving skills and ability to handle multiple projects concurrently.
7.Experience and knowledgeable in Flip Chip C4 Assembly and Packaging including materials and process
8.Experience and knowledgeable in substrate manufacturing process and wafer bumping is preferred.
9.Knowledge on Six Sigma and Lean, BB preferred. 举报 分享

AMD公司成立于1969年，总部位于美国加利福尼亚州桑尼维尔。AMD（NYSE: AMD）是一家创新的科技公司，致力于与客户及合作伙伴紧密合作，开发下一代面向商用、家用和游戏领域的计算和图形处理解决方案。AMD的业务遍布全球，拥有约为12000名员工。