北京招聘

Job Location: Shanghai
Department: Platform and Produce Engineering (PPE)


CDC Platform and Produce Engineering team has immediate opening for a Thermal & Mechanical Design Engineer position. Key responsibilities and requirements are listed below:

KEY RESPONSIBILITIES
? Responsible for thermal & mechanical engineering support and development for AMD dGPU products.
? Entail experimental thermal & mechanical work directed at the development of thermal solutions, mechanical design of components and systems, and analysis of thermal or mechanical aspects.
? Understand the requirements from customers and system design, breakdown into thermal solution level requirements.
? Perform hands-on engineering with the board engineering team, and suppliers/partners in the thermal management field.

REQUIREMENTS
? B.Sc. or M.Sc. In Thermal/Mechanical Engineering or equivalent is required
? Good English skills required – verbal and written

EXPERIENCE AND SKILLS
? A minimum of 3+ years’ experience at computer or Semiconductor Company in thermal and mechanical engineering
? Good lab skills, experience with data acquisition using lab view, and data analysis applied to thermal design
? Experience working with different functional roles, and good communication skills
? Experience with SolidWorks and Pro/E is required
? Experience with Icepak, Flotherm or Ansys is a plus
? Good knowledge of DFM (Design for manufacture)
? Have a strong sense of responsibility and commitment to teamwork



This team is essential to the success of AMD. You will be working with the very best in our technology, while working on some of the most exciting projects the industry has to offer.

AMD公司成立于1969年，总部位于美国加利福尼亚州桑尼维尔。AMD（NYSE: AMD）是一家创新的科技公司，致力于与客户及合作伙伴紧密合作，开发下一代面向商用、家用和游戏领域的计算和图形处理解决方案。AMD的业务遍布全球，拥有约为12000名员工。