北京招聘

Job description

On October 20, 2014, IBM had officially announced selling off IBM's global commercial semiconductor technology business, including intellectual property, world-class technologists and technologies related to IBM Microelectronics to GLOBALFOUNDRIES.

This position is associated with the subject business, which is being divested to GLOBALFOUNDREIS and will operate under GLOBALFOUNDRIES. The successful candidate for this role will be hired or transferred to a position within commercial semiconductor technology business. When the divestiture transaction closes in the applicable country, depending on the local legal environment and management decision, the candidate will either transfer automatically to GLOBALFOUNDRIES in accordance with the processes and practices applicable to other transferring IBM employees.

By applying for this position, you consent that IBM may share and discuss with GLOBALFOUNDRIES all information (including but not limited to your resume/CV) that you provide in association with this application for the purpose of evaluating your qualifications and suitability for the position.

Job Scope:

Chip Design Engineers are working on cutting edge SoC (System on a Chip), ASIC, High Performance Processor, Digital/Analog and Mix-signal Circuit IP design for our clients inside and outside of IBM. By employing the industry leading tools, methodology, and semiconductor technologies ranging from 45nm to 14nm and beyond, you will be participating in the delivery of end to end solutions including architecture design and performance analysis/tuning, front-end logic design and verification, back-end implementation and optimization, circuit IP design, EDA & Methodology development and deployment, as well as Chip hardware validation.

Key Attributes:

1. CS/EE or background in digital or analog Chip Design related areas

2. Research and development experience in one or more of the following areas:

Architectural design, analysis, and optimization

Proficient in Verilog/VHDL, and well conversant with programming and script languages

Digital logic implementation and verification on the basis of the target system specification

SoC design methodology: Knowledge of SoC integration, modeling and verification at different abstract level

ASIC Back-end design methodology: Knowledge of synthesis, timing, DFT, floorplanning, physical design, signal/power integrity, packaging, and other back-end activities.

Electronic Design Automation algorithm, tool, and methodology development

Experience/knowledge in the field of Analog and mixed-signal IP design, test and evaluation with Bulk CMOS, BiCMOS, or SOI technologies.

Good software background and strong C/C++ skill is a plus.

3. Experience in one or some of the application domains, will be a plus

Digital Media, Audio/Video Graphic and Gaming processing

Digital signal processing and RISC Processor architecture

Consumer Electronics applications

Communication, Networking and wireless applications

High Speed Interface/Serdes applications

High performance computing (servers) chipset and ASICs

Other emerging technology and industry areas

4. Good English/communication skill and willingness to work with a global team. Skill of other languages will be a good plus.

5. Good learning competency and be able to work in diverse areas in a flexible environment

Required

Bachelor's Degree

English: Fluent

IBM is committed to creating a diverse environment and is proud to be an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, genetics, disability, age, or veteran status.

IBM（国际商业机器公司），创立于1911年，是全球 IT 产业一家百年企业, 也是全球规模最 大的科技公司之一，业务遍及170多个国家和地区。IBM 转型成为一家认知解决方案和云平台公司，持续借助创新科技、行业专长、诚信助力商业和社会发展。2018年全年总营收达796亿美元。每年在研发领域的投资超过60亿美元。