Senior Product Engineer高级产品工程师
晶晨半导体（上海）有限公司
- 公司规模：150-500人
- 公司性质：外资(欧美)
- 公司行业：电子技术/半导体/集成电路
职位信息
- 发布日期：2014-03-03
- 工作地点：上海-浦东新区
- 招聘人数：若干
- 工作经验：五年以上
- 学历要求：本科
- 职位类别：半导体技术 其他
职位描述
Responsibility:
1.Electrical characterization of specified parameters for SoC devices under HT/LT on different corner lots.
2. Responsible for test data analysis, yield improvement during production ramp-up to smooth mass production.
3. Build up bench test methodology with support of internal design, hardware and foundry engineer.
4. Interface with foundry,subcon and internal teams to handle low yield issue, RMA analysis and other activities to improve product quality.
5. Interface with assembly subcon to improve assembly yields, enhance package quality, review assembly documentation, and solving assembly issues. Maintain database of PODs, bonding diagram ,substrate and net list.
6. Responsible for package evaluation for new product.
7. Work with QA for all the activities to qualify the product including Burn-in, ESD test, etc.
Requirements:
1. Familiar with BGA,QFP,QFN package and process flows, at least 3years experience on subcon.
2. B.S. or above in Electrical Engineering or equivalent with at least 5 years experience in product engineering.
3. Experienced in IC bench characterization on analog circuits, high speed IO such as LVDS, DDR, HDMI and other Audio Video standards.
4. Experienced and versatile in making use of bench equipments, set up automatic tests and data collection.
5. Excellent data analysis, problem solving, and communication skills.
6. Excellent interpersonal and teamwork skills.
7. Work in a fast paced technical environment.
1.Electrical characterization of specified parameters for SoC devices under HT/LT on different corner lots.
2. Responsible for test data analysis, yield improvement during production ramp-up to smooth mass production.
3. Build up bench test methodology with support of internal design, hardware and foundry engineer.
4. Interface with foundry,subcon and internal teams to handle low yield issue, RMA analysis and other activities to improve product quality.
5. Interface with assembly subcon to improve assembly yields, enhance package quality, review assembly documentation, and solving assembly issues. Maintain database of PODs, bonding diagram ,substrate and net list.
6. Responsible for package evaluation for new product.
7. Work with QA for all the activities to qualify the product including Burn-in, ESD test, etc.
Requirements:
1. Familiar with BGA,QFP,QFN package and process flows, at least 3years experience on subcon.
2. B.S. or above in Electrical Engineering or equivalent with at least 5 years experience in product engineering.
3. Experienced in IC bench characterization on analog circuits, high speed IO such as LVDS, DDR, HDMI and other Audio Video standards.
4. Experienced and versatile in making use of bench equipments, set up automatic tests and data collection.
5. Excellent data analysis, problem solving, and communication skills.
6. Excellent interpersonal and teamwork skills.
7. Work in a fast paced technical environment.
公司介绍
晶晨半导体—Amlogic
1995年创立于美国加利福尼亚圣克拉拉，2001年在中国上海成立晶晨半导体(上海)有限公司，并陆续在深圳、北京、香港、台北设立分支机构，分公司及分支机构，专业从事高性能多媒体芯片的设计、研制和应用，现已成为全球领先的无晶圆半导体系统设计公司。
经过十几年的潜心开发，晶晨半导体拥有众多的专业IP、音视频处理技术专利和高清多媒体处理引擎，创造了业内先进的AML Meson系统多核并行处理器技术及3D图形处理技术，为世界领先的消费电子品牌客户和OEM/ODM客户提供半导体整体解决方案。
公司先后推出DVD、HVD、数码相框、平板电脑、机顶盒、流媒体电视、互联网电视、智能电视等一系列芯片，并在市场上取得非常出色的业绩，积累了TCL、创维、海信、海尔、飞利浦、索尼、夏普、小米、阿里巴巴、乐视等众多国内外知名客户。
1995年创立于美国加利福尼亚圣克拉拉，2001年在中国上海成立晶晨半导体(上海)有限公司，并陆续在深圳、北京、香港、台北设立分支机构，分公司及分支机构，专业从事高性能多媒体芯片的设计、研制和应用，现已成为全球领先的无晶圆半导体系统设计公司。
经过十几年的潜心开发，晶晨半导体拥有众多的专业IP、音视频处理技术专利和高清多媒体处理引擎，创造了业内先进的AML Meson系统多核并行处理器技术及3D图形处理技术，为世界领先的消费电子品牌客户和OEM/ODM客户提供半导体整体解决方案。
公司先后推出DVD、HVD、数码相框、平板电脑、机顶盒、流媒体电视、互联网电视、智能电视等一系列芯片，并在市场上取得非常出色的业绩，积累了TCL、创维、海信、海尔、飞利浦、索尼、夏普、小米、阿里巴巴、乐视等众多国内外知名客户。
联系方式
- 公司地址：上班地址：海淀区上地三街9号嘉华大厦E1005