北京招聘

TD Micro-Patterning Engineer(Etch)

Job Purpose

1.Development of etch technologies for advanced 40/28nm technique nodes

2.Take responsibility for daily TD lot move for yield and device learning

3.Take responsibility for 40nm NTO/MPW pilot runs

Job Responsibility:

1.Clearly define module Target spec as layer owner for different technology nodes

2.Provide proposals for deciding process condition to deliver the performance to meet MTS

3.In-line & Off-line SPC control and continuously improvement

4.Develop & maintain new processes and find solution paths for process issues,

5.Defect reduction & yield improvement

6.Transfer developed process to FAB etch

Job Requirements:

1.>2 years etch process experience

2.Major in material, chemistry, physics

3.master or PHD

4.good English writing and speaking

5.good office software usage skill

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