北京招聘

Location: Shenzhen


Job Purpose:
Accomplish engineering assignments in process integration and device technology development.

Job Responsibilties:
1.Compile process flow, EDC and handbook ready for MES and Fab implementation;
2.Interface with module process engineers and resolve related process issues;
3.Manage engineering lot process and handle in-line/off-line process issues;
4.Compile parametric testing and device data analysis.

Job Responsibilities:
1.Bachelor of Science degree in Electronics,Electrical,Mechanical,Microelectronics,Basic Sciences or related majors.A Master's of Science degree would be an added advantage;
2.Extensive knowledge in semiconductor assembly and test processes;
3.Good leader and/or team player, open and disciplined;
4.Good problem solving skills;
5.Proficiency in written and verbal English;
6.Knowledge in wafer fabrication technology,process characterization and data mining would be an added advantage;
7.Good skill in using analysis and report software (Word, Excel, PPT).

中芯国际集成电路制造有限公司（“中芯国际”，纽交所代号：SMI，港交所股份代号：981），是世界领先的集成电路晶圆代工企业之一,也是中国内地技术***面、配套最完善、规模***、跨国经营的集成电路制造企业，提供0.35微米到28纳米不同技术节点的晶圆代工与技术服务。中芯国际总部位于上海，拥有全球化的制造和服务基地。 在上海建有一座300***晶圆厂和一座200***晶圆厂；在北京建有一座300***晶圆厂和一座控股的300***先进制程晶圆厂；在天津和深圳各建有一座200***晶圆厂；在江阴有一座控股的300***凸块加工合资厂；在意大利有一座控股的200***晶圆厂。中芯国际还在美国、欧洲、日本和中国台湾地区设立行销办事处、提供客户服务，同时在香港设立了代表处。详细资讯请参考中芯国际网站*************。