Field Process Engineer-Clean
泛林半导体设备技术(上海)有限公司
- 公司规模:500-1000人
- 公司性质:外资(欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2022-06-28
- 工作地点:深圳
- 工作经验:2年经验
- 学历要求:硕士
- 语言要求:英语良好
- 职位月薪:20-30万/年
- 职位类别:半导体工艺工程师
职位描述
Responsibilities
1. Responsible for completion of process support and installation of equipment at customer sites. This includes evaluation and documentation of process outputs of hardware modifications/upgrades to existing systems.
2. Set up and complete experiments, collect data and generate reports for both internal and external distribution. Will develop new processes for new applications at customer sites on existing equipment.
3. Initiates escalations, quality investigations and PRs. Developing relationship with process engineers in other regions, especially those running like applications.
4. Performs application related Project Management, which includes
5. Plan, conduct and technically direct moderately complex projects.
6. Define problems and objectives, develop approach, analyze results and provide recommendation for new and existing equipment.
7. Work with senior engineers and customers to understand customer technology roadmaps, process flow, inflection points, requirements and business issues/ challenges.
8. Design and complete DOE evaluations to characterize process window for new installations or recommended field hardware modifications/ upgrades.
9. Develop new processes for small variants to existing customer applications.
10. Present technical and marketing materials to a high standard.
11. Any other duties as assigned by the immediate supervisor.
Customer Relations
1. Develop good customer relations during start-up and trouble shooting; Work closely with customer to understand customer issues and demands
2. Professionally represent the company to the customer.
3. Utilize knowledge of company’s product lines and services to keep existing / potential customers informed when new/additional needs are identified.
4. Can support process projects and manage customer and product group to drive to closure
5. Provide technical instruction and mentoring for Engineer levels 1 and 2.
公司介绍
10家办事机构位于:北京、上海、武汉、无锡、西安、大连、厦门、南京和合肥。
泛林集团为客户提供了许多半导体晶圆制造和研发所需的刻蚀、薄膜沉积和清洗等关键设备。泛林集团战略的核心是通过投资向客户提供持续的支持。2019年1月,泛林集团在北京成立技术培训中心,建筑面积1280平方米,开设了刻蚀和沉积技术的相关培训课程。随着增加在中国的培训资源,泛林集团将全面提升对客户的支持,积极助力客户成功。
在过去,我们在中国采购了总计价值数十亿美元的产品与服务,包括泛林集团沉积和刻蚀设备中的关键组件,这充分证明了泛林致力于帮助中国半导体产业链发展的决心。
联系方式
- 公司地址:江北新区研创园团结路99号孵鹰大厦C座701、702室