北京招聘

The Technology & Operation Group of NXP is hiring new college graduates to the Characterization Lab of SPICE modeling team in Tianjin. The main part of the job includes (a) On-wafer device characterization, which includes DC, CV, 1/f noise, s-parameters, pulse IV, etc. The devices include but are not limited to MOS, LDMOS, BJT, diode, resistor, capacitor, etc; (b) Maintain the characterization lab; (c) Develop characterization method for new devices or new tests. Improve measurement efficiency through automation or better methodology. The candidate will be exposed to advanced technologies used by the company, and when time permits will have chance to work on device compact modeling and fab transfer work. The candidate will work closely with modeling, device, and process engineers.

Qualifications

The ideal candidate will have the following qualifications:

• Degree in EE or related field.
• Knowledge and experience with DC, HV, and RF device characterization techniques. A big plus if have used ICCAP.
• Good background in semiconductor device physics or EM.
• Good computer programming skill. Coding experience with Python is a plus.
• Outstanding communication and interpersonal skills.

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.