北京 [切换城市] 北京招聘

Packaging Engineer

恩智浦(中国)管理有限公司

  • 公司规模:10000人以上
  • 公司性质:外资(欧美)
  • 公司行业:电子技术/半导体/集成电路

职位信息

  • 发布日期:2021-06-01
  • 工作地点:天津
  • 招聘人数:1人
  • 工作经验:5-7年经验
  • 学历要求:本科
  • 职位月薪:1.5-2万/月
  • 职位类别:封装工程师

职位描述

Job Summary:

  • Focusing on FCCSP (Flip Chip CSP) package process development
  • Define and validate package designs, materials and processes used for development of new products for NXP.  Develop DOE’s and tests to evaluate suitability and reliability of package solutions.  Work with the Business Lines and the factories (both internal to NXP and OSAT) to qualify the package/product solutions.
  • Manage the package process using industry standard project management tools.
  • Develop solutions by working closely with Package Innovation teams (Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing).
  • Address and solve materials and processing issues that may occur during the development process.
  • May involve international travel to package assembly sites and NXP suppliers.


Job Qualifications:

  • 3~5 years of FCCSP package/process development work experience is highly preferred
  • Bachelor or Master degree in Mechanical Engineering, Automation Engineering or Chemical Engineering
  • CET-6 equivalent or above is preferred
  • Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.
  • Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus.
  • Knowledge of Statistical Analysis and Design of Experiment is a plus.
  • Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.

职能类别:封装工程师

公司介绍

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.

联系方式

  • Email:fiona.chen@nxp.com
  • 公司地址:西青开发区兴华路15号