北京招聘

We are looking for a RF background Packaging Engineer to support our GlobalFoundries Packaging Development group. Your responsibility will be to drive advanced packaging with a main focus on Radar/5G/IoT. Your role is in electrical 3D EM simulation and advanced RF/mmwave chip-package co-optimization design flow development with state-of-art industry tools; act as a technology and interface to various Business Units; work on technology development with R&D partners and institutes.

Your Job

• Matching Networks design for RF unit(Inductor, Balun, Filter, Antenna) on package or chip level.

• RF unit performance(bandwidth, gain, loss, Q) optimization and verification.

• Passive optimization of RF channels for RF chip test board design.

• Industry EDA tools validation, and new RF design flow(2.5D, 3D, AiP) trial run.

• Contribute to GFs RF and mmWave packaging strategy. Work closely with GF′s reference design groups to demonstrate chip package co-design.  

• Act as main technical contact to R&D infrastructure. Drive bilateral packaging projects within the consortia infrastructure. 

Required Qualifications: 

• M.Sc. or Ph.D. in Electrical Engineering, Materials Science or another relevant engineering or physical science with > 5 years industry experience.

• Record has to include: RF electrical EM simulation and optimization on board or package level.

• Good understanding of electrical simulation for specific designs (i.e. Inductor, Balun, Filter, Antenna or RF analog), Experience with simulation tools (ANSYS / HFSS) is a must.

• Understanding RF packaging at > 6GHz (up to 140GHz).  Quantification of frequency related losses (measured S , L and Q). Experience in model to hardware correlation.  

• Good learning competency, teamwork, self-motivation, ability and willingness to work in a flexible and dynamic environment and react to shifting priorities to meet business needs.

• Good communication skills and English to work with a global team, both written and oral are necessary in English

Preferred Qualifications:

• Experience with RF, Antenna layout design (Cadence Allegro, Virtuoso RF).

GLOBALFOUNDRIES is the world's only semiconductor foundry with a truly global manufacturing and technology footprint, with 18,000 employees spanning Asia, Europe and the Americas serving over 250 customers including the world’s leading technology companies. We focus on the processes and platforms that will drive markets, so customers with a shared vision of the future can shape their industries.

This is more than just a job, it’s your fingerprint on the future. An opportunity to make semiconductors core to reshaping our lives and providing connectivity to billions, that are helping realize the Internet of Things and redefining transportation.

GLOBALFOUNDRIES China was born with the acquisition of IBM's semiconductor manufacturing business. The IBM Microelectronics acquisition has added additional fabs, a huge portfolio of patents and a large and highly experienced development team. With a heritage of more than two decades in Singapore and an expanding presence in China and India, come join some of the brightest and most innovative people in the industry. Work with industry-leading customers to facilitate innovations you can feel proud of. Work you truly enjoy taking home.

A career where we say: I helped make that possible.