北京招聘

This position is associated with the sale of Intel’s NAND memory and storage business to SK Hynix (You can read more about the transaction in the press release - ). The transaction will enhance the resources and potential of the business’ storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.

This is an exciting time to be at Intel – come join our NAND-DTM and work on the most advanced 3DNAND and SSD technology in the world. As the global leader in the semiconductor industry, Intel possesses industry-leading SSD technology and the most capable Quadruple Level Cell (QLC) NAND Flash products, and you will be part of a world-class team that will transition to lead the SSD business at SK Hynix.

This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK Hynix.

Intel Dalian is rapidly expanding its 3D NAND high volume manufacturing (HVM) facility, while starting-up a new Dalian Technology Development (DTD) organization to develop future generations of 3D NAND process technologies. We are seeking for strong candidates to join us as a TD Module & Integration Yield Engineer in the Diffusion and Implant Technology Development (TD) Department of DTD, covering LPCVD, ALD, oxidation, implant, thermal & plasma treatments processes on batch, mini-batch or single wafer platforms.The selected candidates will be responsible for activities covering process, equipment, materials, and operations. Examples of scope of work include silicon process improvement and product enhancement, equipment capability evaluation and expansion, and wafer cost reduction.Candidates must have demonstrated a track record of excellence in creative problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization.The ideal successful candidate will:? Demonstrate an in-depth knowledge of DIFFUSION/IMPLANT fundamentals including deposition techniques, plasma physics and thermal treatments. Perform feasibility study and provide module level process solutions to meet desired device specification and process improvement requirements? Lead new process experimentation, implementation and high volume manufacturing readiness in the area of expertise.? Define, select and qualify the equipment platforms to meet quality and output needs of new processes for HVM ramp and transfer the technology to HVM counterpart? Install and qualify first of a kind of tools (FOAK) for TD and audit installation/qualification and train HVM teams and lead tool release to support HVM ramp. Collaborate with HVM teams on continued improvement programs (CIP) for established processes.Develop solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.Develop strategy to resolve difficult problems and establish systems to deal with these problems in the future.Additional Requirements: Engage closely with tool vendors. Drive escalations and ensure resolution to any process and/or equipment problems.Drive improvements on quality, reliability, cost, yield, process stability/capability, productivity and safety/ergonomic over variables. Familiar with multiple characterization techniques including, but not limited to, XSEM, TEM, STEM, XPS, VPD, TXRF, and EELS. Must be flexible in accommodating changing priorities and working hours to support business needs. Excellent communication and team building skills.

Minimum Requirements:
PhD in a science or engineering field or MS plus a minimum 5 years of experience in semiconductor research, development or manufacturing environment are required
Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking
Hands-on experiences in technology development, technology transfer or startup are required
Strong expertise of process characterization, qualification and troubleshooting is required
Direct experience in Silicon Process Technology Development is highly desired.

Other Qualifications:
Motivated self-starter, with strong ability to work independently as well as in a team environment;
Strong verbal and written communication skills in English
Think and operate independently, while simultaneously focusing on many diverse priorities
Flexibility and maturity in facing uncertainties and changing priorities/responsibilities
Commit to aggressive goals and win with a can-do attitude
Act with velocity and a strong sense of urgency
Respect cultural diversity and sensitivity
Agility in learning, improving, and innovating

英特尔全球的***个存储技术研发生产基地，坐落在美丽的海滨城市大连。英特尔大连非易失性存储技术制造基地（Intel Dalian Memory Technology & Manufacturing以下简称DMTM）的拳头产品是英特尔3D NAND芯片。这项低成本高效能的3D NAND产品将撼动现有的市场格局，为我们描绘了一个更加光明的未来。简言之，这里销售的每一块内存芯片，都将对物联网，数据中心，虚拟现实和CPU相关领域的发展产生深远的影响——这些正是英特尔的核心增长领域。因此，大连存储技术研发生产基地对于英特尔的成功以及我们支撑智能互联的世界至关重要。
半导体集成电路是目前中国发展最为迅速的行业之一，并且也是中国“第十二五”“第十三五”等国家战略计划所重点扶持的产业。虽然中国半导体产业起步晚但发展迅速，连续多年保持两位数以上增速，显著高于全球增速。半导体集成电路行业发展前景十分广阔，Intel大连也希望能够接纳并培养出更多更优秀的本土人才。
Why - 集成电路-芯片高端制造
1.芯片制造是高速发展的集成电路产业中极其重要的环节之一；
2.就业前景广阔，待遇优厚；
3.行业技术附加值高，不易被时间淘汰，且从业越久市场价值越高，是一个值得长期发展的前景广阔的行业；
4.国内从业人数逐年增加，产业生态链逐步形成，市场将会有越来越多的晋升机会。
Why – 英特尔半导体是您开启半导体职业生涯的***选择
1.英特尔大连是Intel 全球***的NAND存储芯片集技术研发和规模化量产为一体的基地；
2.接触领先的芯片生产技术；
3.完善的培训体制和以人为本的优秀企业文化；
4.行业内极佳的口碑 & 多年***雇主获得者；
5.极具竞争优势的薪资待遇；
6.工作地点大连 - 气候宜人，房价适中的滨海宜居城市。
申请流程：网申→简历筛选→邀请面试
3.17- 大连理工宣讲
3.18- 大连海事大学宣讲
3.21- 大连现场面试: 海创(大连)科技交流中心酒店
3.22- 东北大学宣讲
3.23- 沈阳：东大校园面试
3.24- 沈阳：香格里拉酒店面试
3.25- 吉林大学宣讲
3.26- 长春：吉大校园面试
3.27- 长春：香格里拉酒店面试