北京招聘

Job Summary:

 

The Assembly Engineer is responsible for assembly process qualification and sustaining, assembly related issue resolution, and development & qualification of new material, equipment and package at China supplier factories. He/She works with Assembly Development, RE, Test Engineering, Q&R, Operations, Planning and supplier team for assembly process improvement, issue investigation & resolution, material disposition, factory audit & certifications, and technology enabling at supplier factories.

Key Responsibilities:

 

1. Manage new Process & Package Development at Subcon and define robust Process/Material and Controls in documented specs which will be used for production.
    
2. Understand assembly process and material to react urgent situation and demand.
3. Investigate the key failure mechanisms of packages under customer application, board process, actual field usage and define it through FMEA document which will prevent failures and provide solutions before it’s released into production
4. Plans and executes qualification and characterization activities including DOE, FMEA and control plans.
5. Defines and reviews specifications and procedures appropriate to the manufacturing process or new equipment.  
6. Conducts new technology and new materials roadmap for internal engineering database.  
7. Conducts continuous process and yield improvement activities through process development/ enhancements.
8. Reviews Engineering & Manufacturing data and disposes the lots that are put on HOLD and lots under MRB after defect analysis is performed.
9. Leads or joins JTRB team to regularly review major assembly engineering projects, quality issues, and provides engineering support to other teams (Ops, planning…)

Qualifications:

1.Graduate of Master or Bachelor’s Degree in Engineering (EE, ECE, ME, Met Eng’g,  ChE or equivalent.)

2.At least 8 years experiences in semiconductor manufacturing as Package or EMS Development or Assembly Process Engineer.

3.Extensive experience in leadframe & laminate-based packages, WLCSP, SiP and other advanced packages.

4.Experience in resolving assembly and SMT related issues.

5.Experience in OSATs / Fab or experience of OSAT management

6.Knowledge in DOE, FMEA, 6-sigma, SPC, 8D or 7-step is preferred.

7.Experience in using design tool or software for IC package or material design, e.g, AutoCAD, Cadence.

8.MS Office (Powerpoint, Excel, Word) user skills.

9.Must be assertive and good in both oral and written English communication.

ADI公司(纳斯达克代码: ADI)又名亚德诺半导体技术（上海）有限公司是高性能模拟、混合信号和数字信号处理(DSP)集成电路(IC)设计、制造和营销方面世界领先的企业，产品涉及几乎所有类型的电子电器设备。 自1965年成立以来，我们一直专注于积极应对电子设备中信号处理的相关工程挑战。 全世界有超过100,000家客户在使用我们的信号处理产品，这些产品在转换、调节、处理物理现象时发挥着十分重要的作用，例如将温度、压力、声音、光、速 度和运动转换为电信号以用于各种电子设备。 我们关注重要的战略市场，在这些市场我们的信号处理技术经常是帮助客户产品实现差异化的关键因素，如工业、汽车、通信和消费电子市场等。

我们生产各种创新产品——包括数据转换器、放大器和线性产品、射频(RF) IC、电源管理产品、基于微机电系统(MEMS)技术的传感器、其他类型传感器以及信号处理产品，包括DSP和其他处理器——全部是为满足广大客户的需求而设计。


ADI公司相信，员工不仅是公司的***财富，也是客户的重要资产。ADI员工乐于接受挑战，深入钻研技术难题，以杰出的才智帮助客户设计和制造产品。ADI工程师不断推动技术进步，推出各种新产品，满足客户在高性能信号处理领域的广泛需求，同时积极创新，降低整体系统成本。ADI认为，所谓创新就是能够协助客户的产品大获成功的解决方案。我们将不少收益投向工程设计与客户服务，促进信号处理新技术开发，使客户能够利用这些新技术设计出既有竞争力，同时拥有增强用户体验特性的产品。信号处理创新为ADI赢得了高额回报，我们将其重新投入工程设计与客户服务，使创新处于良性循环，不断走向深入。

市场发展趋势与ADI公司的核心竞争力相融合 随着数字革命持续发展，转向更高速度与多媒体，同时也在改变人们的通信、娱乐、工作与旅游方式，因此对ADI公司新技术的需求与日俱增。几乎每一类电子设备最受欢迎的特性都蕴含着ADI公司的创新成果。在当今的汽车、数码相机、液晶与等离子电视、蜂窝手机、医疗成像设备以及工厂自动化设备中，利用ADI芯片能够实现更通畅的连接、更生动的图像、更清晰的语音以及更便携的产品。ADI公司的模拟与数字信号处理核心技术已经渗透到每一个角落。

与众不同的历史 过去的五十年来，ADI员工凭借智慧、毅力和竞争精神建立了世界最重要的技术公司之一。事实上，回顾历史，ADI一直实现持续、稳定的盈利，并带来了大量现金流。如此强势的财务表现，使我们能够在半导体行业的各个兴衰期持续投资，源源不断地为客户提供创新产品，并给股东带来丰厚的现金回报。

光明的未来 我们拥有辉煌的过去，对于公司的未来，我们更是充满信心。我们将继续秉承ADI不断创新、高性能、追求卓越的优良传统，锐意进取，攻克更多新的技术难关。无论您是持股人、客户，还是才华出众的员工，我们诚挚邀请您共同体验这一令人振奋的历程。