北京招聘

Job Description
INTEL NSG 3D NAND TD at Intel Dalian is a Technology Development organization to develop future generations of 3D NAND process technologies through innovation, product enhancement, as well as developing and enabling equipment and process capabilities. This job requisition is to seek for strong candidates for the positions of Dry Etch Senior Process Engineer, reporting to Dry Etch Area Manager. In this position, you will work in a dynamic and collaborative environment solving complex and challenging technical problems on sophisticated Dry Etch Processes and Equipment Development. You will be responsible for leading technology development enabling manufacture of innovative 3D NAND Memory products. Designing, executing and analyzing experiments necessary to meet engineering specifications for their process. Participate in development of intellectual property. Development of the equipment necessary to exploit the understanding gained in development (in collaboration with equipment suppliers). Work effectively with the equipment supplier to identify shortcomings, propose and evaluate hardware modification to mitigate issues. Operate manufacturing line in order to integrate the many individual steps necessary for the manufacture of complex 3D NAND memory.

Qualifications

Qualifications:Candidate must have demonstrated a track record of excellence in creative problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization.Technical Qualifications--MS or PhD in a science or engineering field and minimum 2 years of experience in semiconductor R&D environment are required; Candidates with different levels of technical experiences will be considered at different grade levels.--Broad and deep knowledge of plasma dry etch chambers & processes is required;--Hands-on experiences in technology development and technology transfer are highly desired;Other Qualifications --Motivated self-starter, with strong ability to work independently as well as in a team environment; --Strong verbal and written communication skills in English;--Think and operate independently, while simultaneously focusing on many diverse priorities.--Flexibility and maturity in facing uncertainties and changing priorities/responsibilities --Commit to aggressive goals and win with a can-do attitude--Act with velocity and a strong sense of urgency--Respect cultural diversity and sensitivity--Agility in learning, improving, and innovating

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

英特尔全球的***个存储技术研发生产基地，坐落在美丽的海滨城市大连。英特尔大连非易失性存储技术制造基地（Intel Dalian Memory Technology & Manufacturing以下简称DMTM）的拳头产品是英特尔3D NAND芯片。这项低成本高效能的3D NAND产品将撼动现有的市场格局，为我们描绘了一个更加光明的未来。简言之，这里销售的每一块内存芯片，都将对物联网，数据中心，虚拟现实和CPU相关领域的发展产生深远的影响——这些正是英特尔的核心增长领域。因此，大连存储技术研发生产基地对于英特尔的成功以及我们支撑智能互联的世界至关重要。
半导体集成电路是目前中国发展最为迅速的行业之一，并且也是中国“第十二五”“第十三五”等国家战略计划所重点扶持的产业。虽然中国半导体产业起步晚但发展迅速，连续多年保持两位数以上增速，显著高于全球增速。半导体集成电路行业发展前景十分广阔，Intel大连也希望能够接纳并培养出更多更优秀的本土人才。
Why - 集成电路-芯片高端制造
1.芯片制造是高速发展的集成电路产业中极其重要的环节之一；
2.就业前景广阔，待遇优厚；
3.行业技术附加值高，不易被时间淘汰，且从业越久市场价值越高，是一个值得长期发展的前景广阔的行业；
4.国内从业人数逐年增加，产业生态链逐步形成，市场将会有越来越多的晋升机会。
Why – 英特尔半导体是您开启半导体职业生涯的***选择
1.英特尔大连是Intel 全球***的NAND存储芯片集技术研发和规模化量产为一体的基地；
2.接触领先的芯片生产技术；
3.完善的培训体制和以人为本的优秀企业文化；
4.行业内极佳的口碑 & 多年***雇主获得者；
5.极具竞争优势的薪资待遇；
6.工作地点大连 - 气候宜人，房价适中的滨海宜居城市。
申请流程：网申→简历筛选→邀请面试
3.17- 大连理工宣讲
3.18- 大连海事大学宣讲
3.21- 大连现场面试: 海创(大连)科技交流中心酒店
3.22- 东北大学宣讲
3.23- 沈阳：东大校园面试
3.24- 沈阳：香格里拉酒店面试
3.25- 吉林大学宣讲
3.26- 长春：吉大校园面试
3.27- 长春：香格里拉酒店面试