北京招聘

General Purpose/Objectives:

？ Drive a packaging team for new package development from development process post concept approval to launch.

？Responsible to ensure all new package development is within timeline, budget and technical & Quality standards are achieved to maximise profitability.

？Bring team together to ensure proper project execution within team members, BU partner and other interfaces. (Internal Infineon team & external subcon team)

Major Tasks and Activities:

1.Managing package development execution within product/technology development according to project milestone, quality & cost requirements.

2.Aligned with chip/system development, test engineering for all technical, cost and quality aspects during project phase. Inter

3.Support Package Definition group to ensure package platform complexity, product requirement, customer commitment are met

4. Problem solving and trouble shooting of development issues.

5. Responsible for samples, qualification build-up & transfer into manufacturing engineering.

6.Communication channel of dedicated project in OP BE to requestor (e.g. Project Owner, PJM of Product Line, Package group PCK of Product Line).

7. Responsible for regular KLUSA reporting and milestone release in NPI Tool 

8. Reporting project progress to Project Owner / PJM of PL and/or development board in OP BE OSAT.

Job requirements:

Education:

? Bachelor's\Master's Degree in Engineering or Physical Sciences

Training / qualification:

? Project Management Training; IPMA-C trained

? Good Presentation skill; MS project

? Leading teams in a HP company

? 8D / P-D FMEA / SPC

? FTA / Why-why analysis

? Prima / RTPS / Klusa / NERMAL

? Conflict / Crisis Management

? Project Systematic (A / GCM)

Job experience:

?More than 8 years of process (assembly & test) working experience and min 3 years in project management (NPI and also change/transfer projects)

? Able to drive subcons and ensure projects are managed within time, budget and scope of project.

? PSS/IPC ramp up and safe launch experience is necessary.

Extent of technical knowledge in own area:

?Good process & material knowledge in laminate and leadframe packages and interaction to the different functions (laminate design, design rules, process)

?Skilled PJM skillset and strong communicator Eg: communicate upwards towards the project owners/requestors and manage different stakeholder’s conflicting opinions

Extent of technical knowledge in other areas:

? Good understanding of quality requirements (e.g 9 steps qual plan, qualification release criteria)

? Good understanding on operation/ planning/ logistics

? Package Definition and Enabling Process know how

? Audit skills and working in cross functional team setup in OSAT

? Material Engineering and interaction of BOM sets to wafer technology needs

*您向我司通过任何途径投递简历，将视为您同意我司保存或下载简历并将简历所载内容用于招聘目的。

英飞凌科技大中华区凭借着令员工引以为傲的创新产品与技术、专业系统的职业发展体系、以人为本的工作文化和氛围从超过150家本土和跨国企业中脱颖而出，荣膺“2018年大中华区***职场”殊荣。这是继2016年之后，英飞凌再获此项荣誉，也是一家两度获得这一殊荣的半导体企业，彰显了业界对于英飞凌人才发展理念及实践的高度认可，同时也体现了员工对公司的信任与支持。
 
Infineon Greater China has been officially recognized as the Great Place to Work for in 2018. It is the second time since 2016 that we received this honor, which makes us the business in the semiconductor industry that has won this award twice. The award not only shows the industry's high recognition of Infineon's talent development philosophy and practice but also reflects the employees’ confidence and support for Infineon.


Infineon China is Top 30 Best Companies to Work for in Greater China in 2016.
英飞凌中国荣登2016年“大中华区***职场”前30强榜单。

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility and security. In 2018 fiscal year (ending September 30), the Company reported the revenue achieved EUR7.6 billion.
英飞凌科技股份有限公司总部位于德国纽必堡，致力于为现代社会的三大科技挑战领域-高能效、移动性和安全性提供先进的半导体产品与系统解决方案。2018财年（截止到2018年9月30日），英飞凌营业额达76亿欧元。

Infineon has built up a comprehensive industry chain in China, covering Research & Design, Sales & Marketing and Manufacturing Sectors. In Shanghai and Beijing, Infineon has its R&D centers, involved in global research projects. In Wuxi, Infineon’s largest backend manufacturing factory in China produces the high-quality discretes, chipcard and high power semiconductors for both Chinese and global markets. In Beijing, the business is engaged in IGBT assembly. Also, Infineon has sales and marketing offices in Beijing, Shanghai, Shenzhen and Hongkong. Meanwhile, we have long lasting cooperation with China top universities and companies in terms of Sales, Technology Research and Talent Development.
英飞凌在中国建立了涵盖研发、销售及市场、生产、技术支持等在内的完整的产业链。在研发方面，英飞凌在上海、北京建立了应用研发中心，利用国内的人才资源，参与全球的重点项目研究；在无锡的后道生产工厂，为中国及全球其他市场生产先进的分立器件、智能卡芯片和功率半导体产品；在北京的子公司主要从事IGBT组件的生产；并以北京、上海、深圳和香港为中心在国内建立了全面的销售及市场网络。同时，我们在销售、技术研发、人才培养等方面与国内领先高等院校及企业开展了深入的合作。

With the rapid business expansion in China, we sincerely invite high committed and career-oriented talents to join and grow with us. We do believe great minds think alike.
随着英飞凌的业务在中国的迅速增长，我们诚邀您的加入与我们共同迎接挑战，见证英飞凌的成长。

Please send us your resume both in Chinese and English with a copy of your academic diploma, ID card and recent photo via mail or email (Please indicate your applied position in the subject).
有意者请将个人中英文简历、身份证及学历证明复印件和免冠近照一张邮寄或发邮件至本公司（请在信封或邮件标题上注明所应聘职位）。