北京招聘

Job Summary:

· Define and validate package designs, materials and processes used for development of new products for NXP. Develop DOE’s and tests to evaluate suitability and reliability of package solutions.

· Work with Product Business Lines, Global Package Innovation teams, Process engineering (both internal to NXP and subcons) and Suppliers to establish and conduct physical / chemical material selection characterizations for new materials and qualify the product-package solutions.

· Establish a strong understanding to certify reliable solutions of different metals and alloys integrated into IC leaded and laminate packaging systems.

· Apply advanced methods and technologies to research metal and plating properties improving techniques.

· Establish applicable analytical tools and test methodologies to ensure plating / metal integration.

· Manage the package process using industry standard project management tools.

· Develop solutions by working closely with Package Innovation teams (Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing).

· Address and solve materials and processing issues that may occur during the development process.

· May involve international travel to package assembly sites and NXP suppliers.

Job Qualifications:

· Master or above. in Materials Science or Metallurgical Engineering.

· Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.

· Strong Problem-solving skills determining innovative ways to improve processes and resolve issues related to manufacturing and design

· Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus.

· Knowledge of Statistical Analysis and Design of Experiment is a plus.

· Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.