北京招聘

DMTM & Dept briefing/introduction:

Dalian is home to DMTM, Intel’s first memory fabrication site. DMTM is a state of the art memory maker and manufacturer, its 3D NAND Chip was born to shake up the market with its low cost and higher performance technology. As Memory and storage are key drivers of growth for Intel, the work being done at DMTM is critical to our long-term vision for success. For every piece of memory we sell, we build further inroads to other Intel key growth areas—IoT, data center, and CPU opportunities. Memory is a part of the foundation of technology that powers the smart, connected world we hope to bring to everyone.

Intel Dalian is rapidly expanding its 3D NAND high volume manufacturing facility, and now we are seeking for many strong candidates to join CS-Cooperate Service department. You will join an elite group who work at our high-tech fabrication facilities worldwide, using state-of-the-art manufacturing processes and tools. Delivering operational efficiency, maintenance, testing and commissioning solutions effectively collaborating with construction and operations teams. You will provide facilities engineering leadership to the site organizations in support of Safety, Reliability, Quality, Environmental and Cost objectives with construction, maintenance of equipment, machinery, facilities systems, buildings, and structures. Whether it's building a factory or keeping Intel's manufacturing facilities operating to our high standards, we have the same goal of world class. In any given workday, you will be given responsibility for creating a safe and productive environment.

Your new position is associated with the sale of Intel’s NAND memory and storage business to SK hynix. (You can read more about the transaction in the press release). The transaction will enhance the resources and potential of the business’ storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data. In your role, you will be part of a world-class team that will transition to lead the SSD business at SK hynix.

This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK hynix.

Job responsibility:

Responsibilities include, but are not limited to:

• Owning safety within area of influence ensuring systems operate reliably to avoid manufacturing/facility or operations impacts by meeting up time goals.
• Overlooking projects to meet design criteria, scope, budget, and schedule oversight of planning, design, reconfiguration, construction, maintenance, and modifications to equipment, machinery, facilities systems, buildings, and structures as required to support business requirements delivering operational efficiency, maintenance, testing and commissioning solutions effective collaboration with construction and operations teams to coordinate work in the field identify and implement opportunities to achieve lowest cost of ownership to key stakeholders while maintaining reliability.

Results are delivered through the application of engineering skills and tools systematic problem solving statistical validation of system performance collaboration with the Site Facility management team, suppliers, and key stakeholders and through in-depth understanding of the operating systems to determine and ensure compliance to existing standards, specifications, building codes, and processes.

Qualification (Knowledge and skills required)

• 3-8 years working required in similar field/industries is preferred.
• Strong analytical skills and knowledge of statistical methods, including Statistical Process Control, Excellent problem solving and analytical skills, Ability to lead cross-functional teams for issue resolutions.
• Ability to communicate strategic and tactical concepts across a wide range of employees like engineering peers, operational technicians and management.
• Good troubleshooting, presentation, teamwork and collaboration skills, work with all levels of management and a diverse customer base, including technical and non-technical partners.
• Experience or equivalent skillset in related CS areas like Electrical/Water/Gas/Mechanical/Chemistry
• Some travel may be required to support specific project assignments.
• Good multitasking and organizational skills.
• Effective communication skills in both written and spoken English.

Education (Desired degree & major)

• Must have a Bachelor or Master of Science degree in Electrical/Water/Gas/Mechanical/Chemistry

英特尔全球的***个存储技术研发生产基地，坐落在美丽的海滨城市大连。英特尔大连非易失性存储技术制造基地（Intel Dalian Memory Technology & Manufacturing以下简称DMTM）的拳头产品是英特尔3D NAND芯片。这项低成本高效能的3D NAND产品将撼动现有的市场格局，为我们描绘了一个更加光明的未来。简言之，这里销售的每一块内存芯片，都将对物联网，数据中心，虚拟现实和CPU相关领域的发展产生深远的影响——这些正是英特尔的核心增长领域。因此，大连存储技术研发生产基地对于英特尔的成功以及我们支撑智能互联的世界至关重要。
半导体集成电路是目前中国发展最为迅速的行业之一，并且也是中国“第十二五”“第十三五”等国家战略计划所重点扶持的产业。虽然中国半导体产业起步晚但发展迅速，连续多年保持两位数以上增速，显著高于全球增速。半导体集成电路行业发展前景十分广阔，Intel大连也希望能够接纳并培养出更多更优秀的本土人才。
Why - 集成电路-芯片高端制造
1.芯片制造是高速发展的集成电路产业中极其重要的环节之一；
2.就业前景广阔，待遇优厚；
3.行业技术附加值高，不易被时间淘汰，且从业越久市场价值越高，是一个值得长期发展的前景广阔的行业；
4.国内从业人数逐年增加，产业生态链逐步形成，市场将会有越来越多的晋升机会。
Why – 英特尔半导体是您开启半导体职业生涯的***选择
1.英特尔大连是Intel 全球***的NAND存储芯片集技术研发和规模化量产为一体的基地；
2.接触领先的芯片生产技术；
3.完善的培训体制和以人为本的优秀企业文化；
4.行业内极佳的口碑 & 多年***雇主获得者；
5.极具竞争优势的薪资待遇；
6.工作地点大连 - 气候宜人，房价适中的滨海宜居城市。
申请流程：网申→简历筛选→邀请面试
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