北京招聘

DellEMC PSE (Platform System Engineering) team at Shanghai COE is hiring thermal design intern, focusing on the storage thermal design and qualification activities.
Duties and Responsibilities:
Work under general direction to conduct thermal design, simulation and analysis.
Verify product cooling performance by temperature and airflow measurement.
Document and analyze test results, pro-actively seek solutions and drive corrective action.
Extensively work with counterparts and cross organizational groups in the US on project planning and validation activities.
Develop script for task automation or data analytics.
 
Skills:
Good knowledge of heat transfer technology and familiar with thermal testing tools such as temperature data logger and wind tunnel.
Be able to use CFD simulation software Fluent or Flotherm.
Good verbal and written communication skills.
Knowledge in analysis, reporting, troubleshooting, and applying corrective action.
Knowledge or interest on electrical components and devices is a plus.
Must have high initiative, sharp investigative ability, and a high desire for learning.

Dell Technologies helps organizations and individuals build a brighter digital tomorrow. Our company is made up of more than 150,000 people, located in over 180 locations around the world. We’re proud to be a diverse and inclusive team and have an endless passion for our mission to drive human progress.

What’s most important to us is that you are respected, feel like you can be yourself and have the opportunity to do the best work of your life -- while still having a life. We offer excellent benefits, bonus programs, flexible work arrangements, a variety of career development opportunities, employee resource groups, and much more.

We started with computers, but we didn’t stop there. We are helping customers move into the future with multi-cloud, AI and machine learning through the most innovative technology and services portfolio for ？the data era. Join us and become a part of what’s next in technology, starting today.

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