(高级)应用工程师(蓝牙) - 03960
戴泺格半导体(深圳)有限公司
- 公司规模:1000-5000人
- 公司性质:外资(欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2019-10-15
- 工作地点:深圳
- 招聘人数:若干人
- 工作经验:无工作经验
- 学历要求:招若干人
- 语言要求:不限
- 职位月薪:4-5万/月
- 职位类别:半导体技术 嵌入式软件开发(Linux/单片机/PLC/DSP…)
职位描述
Dialog Semiconductor is a leading provider of custom, highly-integrated and configurable mixed-signal ICs, backed by world-class manufacturing partners. We are a socially responsible employer pursuing programs that benefit our employees, stakeholders and community.
Dialog’s custom power management, configurable mixed-signal and highly-integrated connectivity ICs deliver outstanding efficiency, flexibility and performance advantages. Dialog’s ICs make it possible to develop the next generation of smart devices for consumers and businesses by enhancing product functionality, accelerating the pace of innovation and powering the smart connected future.
Dialog has a renowned reputation for flexible, dynamic support and world-class innovation. The world’s leading electronics manufacturers and suppliers trust Dialog to deliver, thanks to our decades of experience as an established business partner in the rapid development of custom ICs.
Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment we operate in. Dialog Semiconductor plc is headquartered in London with a global sales, R&D and marketing organization. In 2018, it had US$1.442 billion in revenue and was one of the fastest growing European public semiconductor companies. It currently has approximately 2,100 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German TecDax index.
For more information, visit www.dialog-semiconductor.com.
As part of our continued growth, we are seeking a Senior Applications Engineer – SW Support for Bluetooth Product Line for the Application Engineering APAC (Sales) Department to provide hands-on software support for DA14xxx Bluetooth product line, working as part of the APAC & Japan AE team. This role will work alongside the local FAE teams and provide turnkey support for key customers and the wider market in APAC & Japan.
The Role
Working in the Global Manufacturing Department based in Shenzhen, China, you will:
- Support customers on their application software / profile implementation on Smartbond (and roadmap products). Ability to provide deep level hands-on customer support in elements such as debugging, code porting, code optimisation, peripheral utilization , clocking , memory configuration customers own profile development, tool optimization and general software/hardware support of MCU, testing and optimizing for manufacture.
- Customise reference designs from the Business unit to local customer needs.
- Create proof of concepts and demo’s (including developing software)
- Support where necessary customers modifying/developing custom profiles
- Provide feedback to the product line on suggestions to improve deliverables : tools / device / architecture / reference designs
- Support Dialog sales , FAE and distributor channel in opportunities as directed by AE team leader.
- Provide APAC customers with Production Test support.
- Build localised bluetooth stack knowledge for support of the region.
- Support the online support model (through the Dialog Forums)
- Some on-site customer travel will be required.
What Are We Looking For?
- At least 5 years of working experience with bachelor degree or 3 years of working experience with master degree
- Solid Embedded MCU software knowledge - 100% necessity
o Thoroughly experienced with toolchains (e.g. Keil/IAR etc..), debuggers & general too chains.
o Experience in MCU SW /Register Architecture (Cortex –M preferred).
o Understanding of high-level embedded C
o Confident in ability to help customers modify/optimise/debug
o Experience in developing with embedded C from ground up OR extensive experience in similar programming environment is required.
o Experience in taking MCU based products through design to production.
o RTOS experience (free RTOS, Android, Ubuntu, WinCe etc)
o Knowledge of bluetooth stack and advantage.
- Solid MCU Hardware Knowledge – 100% necessity
o Knowledgeable in MCU hardware peripherals
o Clocking & Timers / input & output / XTAL / UART, SPI, i2c/ memory utilisation/ DMA etc.
- General wireless market knowledge is a strong advantage, especially Bluetooth
Why join us?
We passionately believe that working at Dialog, you will be joining the brightest, most diverse and ambitious talent in the Semiconductor Industry. We are proud to have won numerous awards and designs, including exclusive patents that have assisted us to years of double-digit growth in this highly competitive industry. With growth planned for 2019, the opportunity for talent to progress at Dialog could not be greater. We are fast becoming the employer of choice within microelectronics chip design, power management solutions, short-range wireless connectivity and AC/DC power conversion.
If you'd like to explore working for Dialog Semiconductor further, then it's time we heard from you. Click below and apply now.
This publication is issued to provide outline information only, which unless agreed by Dialog Semiconductor may not be used, applied, or reproduced for any purpose or be regarded as a representation relating to products. All use of Dialog Semiconductor products, software and applications referred to in this document are subject to Dialog Semiconductor’s Standard Terms and Conditions of Sale, available on the company website (www.dialog-semiconductor.com) unless otherwise stated.
Dialog and the Dialog logo are trademarks of Dialog Semiconductor plc or its subsidiaries.
All other product or service names are the property of their respective owners.
© Dialog Semiconductor 2019. All rights reserved.
公司介绍
Dialog执行稳健,增长快速,并具有强大的现金产生能力;截至2018年12月31日,现金及现金等价物余额为6.78亿美元。全球员工总数达2,100人(工程师约占75%)。
Dialog作为雇主积极承担社会责任,开展各项活动造福员工、社区、其他利益相关方和自然环境。
关键要点
智能手机PMIC市场份额排名***
智能手机RapidCharge?快充电源适配器IC市场份额排名***
可配置混合信号IC(CMIC)市场份额排名***
集成度***,采用可配置电源管理模式的完整系统方法
2017年,我们交付了超过1亿套SmartBond? SoC,创下了里程碑
蓝牙低功耗市场份额排名***,交付了超过1.8亿套具有业内最低功耗的蓝牙芯片。
2018年营收达14.42亿美元
联系方式
- 公司地址:天津经济技术开发区信环西路19号泰达服务外包产业园