北京招聘

Job Description

The Technology & Operation Group of NXP is hiring both new college graduate and experienced engineers to the SPICE modeling team in Beijing. The main part of the job includes (a) create high quality compact models for semiconductor devices to allow circuit simulations on SPICE simulators, such as spectre and ADS; (b) device characterization; (c) support technology transfer between fabs. The devices include but are not limited to MOS, LDMOS, BJT, ESD, etc. The compact models are created by multiple steps, such as measurement, parameter extraction, QA, and documentation. The other part of the job is to develop tools for modeling, fab transfer, and design. The candidate will work closely with senior device, process, and design engineers. The candidate will also work with foundries when required by tasks.

The ideal candidate will have the following qualifications:

• PhD or Master in EE or related field.
• A strong background in semiconductor device physics. Having the following are considered big plus: Knowledge and experience on compact models such as BSIM, PSP, HICUM, MEXTRAM; experience with ICCAP; Knowledge on Verilog-a coding; trouble-shooting skill.
•  Good computer programming skill. Coding experience and skill with language C, Perl, Python is a plus.
•  Knowledge of DC & RF device characterization techniques
•  Outstanding communication and interpersonal skills

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.